Study on Single-Plane Biaxial Balance Monitor System in ULTRA-Precision Grinding

L. Zheng; Yin Biao Guo; Z.Z. Wang

doi:10.4028/www.scientific.net/KEM.304-305.251

Paper Titles

Study on Critical Ductile Grinding Depth of Nano ZrO₂ Ceramics by the Aid of Ultrasonic Vibration
p.232

Study on Grinding Waviness on Outer Race of Ball Bearing and Vibration Reducing Skills
p.236

Raman Microspectroscopy Study on the Ground Surface of Monocrystalline Silicon Wafers
p.241

Model Establishment of Chip-Formation due to Shock under Ultra-High Speed Grinding
p.246

Study on Single-Plane Biaxial Balance Monitor System in ULTRA-Precision Grinding
p.251

Machinability Evaluation of Engineering Ceramics with Digraph Method
p.256

Studies on the Grinding Characteristics of SiC Particle Reinforced Aluminum-Based MMCs
p.261

Mechanism Analysis of Improving Grinding Quality with Machining Fluids of Oil Filmed Water Droplets
p.266

Prediction of Surface/Subsurface Crack Damage of Ground Ceramics
p.271

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Study on Single-Plane Biaxial Balance Monitor System in ULTRA-Precision Grinding

Abstract:

This paper puts forward an intelligent single-plane biaxial balance monitor system, which is used in ultra-precision grinding. It adopts the method of single-plane balance correction for the vibration of wheel and workpiece. And this system can also be used for integral balance. For ultra-precision grinding, caused by the mutual influence of the vibration of wheel and workpiece, there will be a ripple on the workpiece surface, which is mainly influenced by the frequency ratio of wheel to workpiece, the feed rate and the vibration of wheel and workpiece. This system can improve the machining accuracy, reduce the surface error of workpiece and appraise the integrated machining result, by analyzing the vibration data of wheel and workpiece and adjusting machining parameters.