Fracture Characteristic of Single Crystalline Silicon Using Nano-Indentation and Finite Element Analysis

Abstract:

Nano-indentation test is used widely to determine the fracture toughness of brittle materials and to provide information on important material properties such as the Young’s modulus and hardness. In this study, using nano-indentation testing, atomic force microscope (AFM), and finite element method (FEM), we performed the indentation fracture toughness and fracture strength measurement for a (100) single crystalline silicon at different load states. In addition, the loads of the phase transformation events during unloading were estimated by the load-depth curves. The phase transformation load and micro-crack propagation events at pop-out during the unloading process depended on the maximum applied indentation load.

• Periodical: Key Engineering Materials (Volumes 306-308)
• Pages: 601-606
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.306-308.601
• Online since: March 2006
• Authors: Seung Baek, Jae Mean Koo, Chang Sung Seok
• Keywords: Fracture Toughness, Phase Transformation, Silicon

References

[1] Domnich, V., Gogotsi, Y., High pressure surface science, Handbook of Surfaces and Iterface of Materials(2001), H.S. Nalwa, Academic Press, New York, pp.195-237.

DOI: 10.1016/b978-012513910-6/50024-4

[2] Hu, J.Z., Merkle, L.D., Menoni, C.S., Spain, L.L.; Crystal data for high-pressure phases of silicon, Physical Review, B34 (1986), pp.4679-4684.

DOI: 10.1103/physrevb.34.4679

[3] Pfrommer, B.G., Cote, M., Louie, N.G., Allan, D.R.; Ab initio study of silicon in the R8 phase, Physical Review, B56 (1997), pp.6662-6668.

[4] T. Vodenitcharova, L.C. Zhang.; A mechanics prediction of the behaviour of mono-crystalline silicon under nano-indentation, International Journal of Solids and Structures, 40 (2003), pp.2989-2998.

DOI: 10.1016/s0020-7683(03)00119-7

[5] Dukino. R, Swain. N. V.: Comparative measurement of indentation fracture toughness with Berkovich and Vickers indenters, Journal of American Ceramics Society. 75 (1992), pp.3299-3304.

DOI: 10.1111/j.1151-2916.1992.tb04425.x

[6] Liang K. M., Toricillas R, Orange G and Fratozzi G.: Evaluation by indentation of fracture toughness of ceramic materials, Journal of Material Science, 25(1990), pp.207-224.

[7] Bull S. J.: Interface engineering and grade films: Structure and characterization, Journal of Vacuum Science Technology, A 19 (2001), pp.1404-1414.

[8] X. L, B. Bhushan. : Micro/nanomechanical characterization of ceramic films for microdevices, Thin Solid Films, 340 (1999), pp.210-217.

DOI: 10.1016/s0040-6090(98)01153-5

[9] T.A. Laursen, J.C. Simo.: A study of the mechanics of microindentation using finite element, Journal of Material Research, 7 (1992), 618.

[10] DeBoer, M. P, Huang, H, Nelson, J.C., Jiang, Z. P, and Gerberich, W. : Fracture Toughness of Silicon and Thin Film Micro Structures by Wedge Indetation, Materials Research Society Symposium, 308 (1993), pp.647-652.

DOI: 10.1557/proc-308-647

[11] Peterson. : Silicon as a Mechanical Material, Proc. IEEE, Vol. 70. No 5 (1982), pp.420-475.

[12] Greek, S., and Ericson, F.: Young's modulus yield strength and fracture strength of microelemements determined by tensile testing, Materials Research Society Symposium 518(1998), pp.51-56.

DOI: 10.1557/proc-518-51