Warpage Analysis of FBGA (Fine Ball Grid Array) Package by the Altered EMC (Epoxy Molding Compound) Filler Contents

Yong Tae Park; Yoo Kyoung Whang; Joon Ki Hong; Kwang Yoo Byeon

doi:10.4028/www.scientific.net/KEM.306-308.625

Paper Titles

Fracture Characteristic of Single Crystalline Silicon Using Nano-Indentation and Finite Element Analysis
p.601

Study on Self-Consistent Mesh Generating Method of Hexahedron Element Based on the Local Waveform Method with Damping
p.607

Study on Torque Analysis of Micro-Electromagnetic Clutch by Using the Finite Element Method
p.613

A Study on Relationship between Hardness and Hydrostatic Stress
p.619

Warpage Analysis of FBGA (Fine Ball Grid Array) Package by the Altered EMC (Epoxy Molding Compound) Filler Contents
p.625

Application of Grid-Based Approach for Auto Mesh Generation of Vacuum Chamber
p.631

Finite Element Analysis of the Repeated Braking with 3-D Coupled Model
p.637

Solder Joint Reliability Analysis of WLCSP Based on Inelastic Analysis
p.643

Time and Frequency Domains Iterative Regularization for Inverse Analysis of an Instrumented One-Point Bend Specimen
p.649

HomeKey Engineering MaterialsKey Engineering Materials Vols. 306-308Warpage Analysis of FBGA (Fine Ball Grid Array)...

Warpage Analysis of FBGA (Fine Ball Grid Array) Package by the Altered EMC (Epoxy Molding Compound) Filler Contents

Abstract:

In a semiconductor packaging process, the warpage greatly has influenced the reliability of the package as well as the workability. The strip warpage in FBGA package result from the structure of constitutes and the thermal mismatch by the mechanical or thermal properties such as CTE (Coefficient of Thermal Expansion) and Modulus of EMC, substrate, chip and adhesive materials. Therefore, the optimization of material properties and the package structure design has been needed by the numerical analysis. EMC used as one of the package constituents has a decisive effect on the trend of warpage, and the filler content is dominant in the EMC property. In this research, firstly the effect of the filler contents is evaluated in the warpage of FBGA package and the numerical analysis is performed with the high temperature – material properties to deal with the warpage under the actual measurement value.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 306-308)

Pages:

625-630

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.306-308.625

Citation:

Cite this paper

Online since:

March 2006

Authors:

Yong Tae Park, Yoo Kyoung Whang, Joon Ki Hong, Kwang Yoo Byeon

Keywords:

Epoxy Moulding Compound (EMC), FBGA, Package, Warpage

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] L. T. Manzione: Plastic Packaging of Microelectronic Devices, New York: Van Nostrand Reinhold (1990), pp.284-287.

Google Scholar

[2] J. Oda and J. Sakamoto: Application of FEM for multiple laminated structure in electronic packaging, Finite Elements in Analysis and Design, Vol. 30 (1998), pp.147-162.

DOI: 10.1016/s0168-874x(98)00030-4

Google Scholar

[3] A. Hamzehdoost and L. Yip: Package Warpage Evaluation for High Performance PQFP, Electronic Components and Technology Conference 45 th, (1995), pp.229-233.

DOI: 10.1109/ectc.1995.514389

Google Scholar

[4] K. Miyake, G. B. Hyung and W. P. Sang: Viscoelastic Warpage Analysis of Surface Mount Package, ASME J. Electronic Packaging, Vol. 123 (2001), pp.101-104.

DOI: 10.1115/1.1339820

Google Scholar

[5] T. S. Dickson and M. F. Matthew: Warpage of Plastic IC Packages as a Function of Processing Condition, ASME J. Electronic Packaging, vol. 123 (2001), pp.286-272.

Google Scholar

[6] P. S. Turner: J. Res. Natn. Bureau Standards USA 37, (1946), 239.

Google Scholar

[7] H. S. Lee: Fabrication Process and Thermal Properties of SiCp/Al Metal matrix Composites for Electronic Packaging Applications, J. Materials and Science, Vol. 35 (2000), no. 24 pp.6231-36.

Google Scholar