Low Temperature Sintering of Alumina by CuO-TiO2-Nb2O5 Additives

Koichi Shigeno; Hidenori Katsumura; Hiroshi Kagata; Hiroshi Asano; Osamu Inoue

doi:10.4028/www.scientific.net/KEM.320.181

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Micropattern of Colloidal Crystal by Using Electrophoretic Deposition Process with Three-Electrode System
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Synthesis of a New Photochromic ZrO₂ Precursor for Preparation of Functional Thin Films
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Low Temperature Sintering of Alumina by CuO-TiO₂-Nb₂O₅ Additives
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A Technique for Permittivity Measurement of Ceramic Powders at Microwave Frequencies
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High Frequency Dielectric Mapping Using Un-Contact Probe for Dielectric Materials
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Evaluation of Characteristics of Composite Electromagnetic Wave Absorbers
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Effect of Lanthanum Oxide Addition on Dielectric Loss and Microstructure of AlN Ceramics
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Low Temperature Sintering of Alumina by CuO-TiO₂-Nb₂O₅ Additives

Abstract:

We examined sintering additives for alumina. When using CuO-TiO2-Nb2O5 additive, dense sintered alumina was obtained by firing at 1000°C or below, even though additive content was at most 10 mass%. It is considered that the formation of mixed oxide consists of CuO, TiO2 and Nb2O5 has an important role for low temperature sintering of alumina. Thermal conductivity of the above sample was 15 W/mK, which was the highest value yet reported within LTCC (Low Temperature Co-fired Ceramics) materials.