Experimental Study on the Ultraprecision Lapping Technology of the Copper Substrates for Alloy Films

Abstract:

To obtain the amorphous alloy films with superior properties by method of electrochemical deposition, the accuracy requirement for the copper substrates for Alloy Films is extraordinarily strict. The ultraprecision lapping technology for the copper substrate employing polyurethane polishing pad and flannel pad is studied in this paper, surface roughness, material removal rate and change process of surface construction of copper substrates are discussed. The influences of the different lapping parameters on the surface roughness, material removal rate and the influences of lapping load on copper substrate surface formation in the ultraprecision lapping process of copper substrate are both discussed. Experiment results show that the surface scratch will disappear by employing polyurethane polishing pad and flannel pad, and an extremely smooth surface of copper substrate with roughness 6nm Ra is obtained in the final finishing lapping process.

• Periodical: Key Engineering Materials (Volumes 359-360)
• Pages: 349-354
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.359-360.349
• Online since: November 2007
• Authors: Cong Rong Zhu, Qin Xu, Ju Long Yuan, Dong Hui Wen, Bing Hai Lv
• Keywords: Copper Substrate, Surface Formation, Ultra-Precision Lapping

References

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