Study on the Temperature Field of Cemented Carbide Substrate in Miniature EACVD System

Hong Xiang Wang; Dun Wen Zuo; Wen Zhuang Lu; Feng Xu; Dang Zeng; Jian Liang Shen

doi:10.4028/www.scientific.net/KEM.375-376.525

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Investigation on Simulation for Grind-Hardening Temperature Field of Non-Quenched and Tempered Steel
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 375-376Study on the Temperature Field of Cemented Carbide...

Study on the Temperature Field of Cemented Carbide Substrate in Miniature EACVD System

Abstract:

The uniform distribution and the stability of the substrate temperature are the most important factors that deeply affect the quality and the growth rate of diamond films. In this paper, cemented carbide cutters were chosen for substrates, the 3D finite element (FE) model of filaments and substrates was developed in ANSYS 8.0, the calculated results show that the substrate temperature is influenced by the filament temperature, filaments diameter, the quantity of the filaments and the distance between the filaments and the substrates. The 3D finite element model of filaments and substrates also provides a basis for selecting the parameters to obtain uniform diamond films in miniature EACVD system.

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Key Engineering Materials (Volumes 375-376)

Pages:

525-529

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.375-376.525

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Online since:

March 2008

Authors:

Hong Xiang Wang, Dun Wen Zuo, Wen Zhuang Lu, Feng Xu, Dang Zeng, Jian Liang Shen

Keywords:

Cemented Carbide Tools, Diamond Film, Fe, Miniature EACVD System, Substrate Temperature Field

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