Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

Abstract:

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Accelerated thermal cycling (ATC) tests were conducted to investigate an effect of thermal cycle conditions on thermal fatigue life of a chip size package (CSP) lead-free solder joint. A ternary Sn-Ag-Cu alloy was used as a lead-free solder material. For frequency of thermal cycle (1~3 cycles/h) and maximum (388~423 K) and minimum (223~273 K) temperatures investigated, the effects of them on thermal fatigue life of the solder joint were slight. On the contrary, correlation was recognized between temperature amplitude and thermal fatigue life of the solder joint. The thermal fatigue life increased with decreasing temperature amplitude. The relationship obeyed the Coffin-Manson’s type equation.

Info:

Periodical:

Key Engineering Materials (Volumes 385-387)

Edited by:

H.S. Lee, I.S. Yoon and M.H. Aliabadi

Pages:

433-436

DOI:

10.4028/www.scientific.net/KEM.385-387.433

Citation:

I. Shohji et al., "Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint", Key Engineering Materials, Vols. 385-387, pp. 433-436, 2008

Online since:

July 2008

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Price:

$35.00

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