Application of Instrumented Indentation Technique to Evaluate Residual Stress and Stress Directionality

Abstract:

The instrumented indentation technique (IIT) is a powerful method for evaluating mechanical properties of materials such as elastic modulus, tensile strength, fracture toughness and residual stress. Especially, IIT is a promising alternative to conventional methods of residual stress measurement such as hole drilling, saw cutting, X-ray/neutron diffraction, and ultrasonic methods because of its various advantages of nondestructive specimen preparation, easy process, characterization of material properties on local scales and measurement of in-service structures. Evaluation of residual stress using IIT is based on the key concepts that the deviatoric-stress part of the residual stress affects the indentation load-depth curve and that the quantitative residual stress in a target region can be evaluated by analyzing the difference between the residual stress-induced indentation curve and residual stress-free curve. To verify the applicability of the suggested technique, indentation tests were performed on the welded zone.

• Periodical: Key Engineering Materials (Volumes 385-387)
• Pages: 889-892
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.385-387.889
• Online since: July 2008
• Authors: Min Jae Choi, In Geun Kang, Kwang Ho Kim, Dong Il Kwon
• Keywords: Directionality, IIT, Instrumented Indentation Technique, Knoop, Residual Stress

References

[1] W.C. Oliver and G.M. Pharr: J. Mater. Res. Vol. 7 (1992), p.1564.

[2] J. -H. Ahn and D, Kwon: J. Mater. Res. Vol. 16 (2001), p.3170.

[3] J. -Y. Kim, K. -W. Lee, J. -S. Lee and D. Kwon: Surf. Coat. Technol. Vol. 201 (2006), p.4278.

[4] J. S. Lee, J. I. Jang, B. W. Lee, Y. Choi, S. G. Lee and D. Kwon: Acta Mater. Vol. 54 (2006), p.1101.

[5] Y. -H. Lee and D. Kwon: Scripta Mater. Vol. 49 (2003), p.459.

[6] Y. -H. Lee and D. Kwon: Acta Mater. Vol. 52 (2004), p.1555.

[7] J. Lu, M. R. James and G. Roy, in: Handbook of Measurement of Residual Stresses, Fairmont Press, Lilburn (1996).

[8] I. C. Noyan and J. B. Cohen, in: Residual Stresses, Springer-Verlag, New York (1987).

[9] Y. Choi, Y. -H. Lee, J. -i. Jang, S. -K. Park, K. -H. Kim, Y. -W. Seo and D. Kwon: Key Eng. Mater. Vol. 297-300 (2005), p.2122.