Research on Wheel Wear in HIPSN Bearing Ring High Speed Grinding

He Wang; Yu Hou Wu; Ke Zhang; Song Hua Li

doi:10.4028/www.scientific.net/KEM.416.77

Paper Titles

Study on the Rheological Effect Models of Fluid Magnetic Abrasive
p.54

Study on Precision Measuring Method of Reloading Machine Tool
p.61

Study on Subsurface Damage Model of the Ground Monocrystallinge Silicon Wafers
p.66

Error Separation and Correction Technology of Precision Measuring System in Aspheric Fine Grinding Phase
p.71

Research on Wheel Wear in HIPSN Bearing Ring High Speed Grinding
p.77

Research on Technology of Pulse Electrochemical and its Compound Finishing
p.82

Simulation of Compacting Process for Semi-Fixed Abrasive Wheel
p.87

Research on NC Grinding Accessories of Isometric Polygonal Profile
p.93

A Method for Calculating the Maximal Temperature of Single Grain though Analyzing the Grinding Temperature Signal
p.98

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Research on Wheel Wear in HIPSN Bearing Ring High Speed Grinding

Abstract:

This paper reports on the wheel wear in high speed grinding silicon nitride used metal bond diamond wheels. The investigation focuses on the relation among grinding force, grinding ratio and wheel wear. Experiments have been performed to investigate the factor of wheel wear such as grinding ratio and grinding force. The results of these investigations are presented in this paper. With the application of this technology, a low cost production and high efficiency of ceramic bearing ring grinding can be realized.