Electrical Properties of Conductive Paste with Silver Nanoparticles and its Application to Flexible Substrates

Abstract:

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Silver nanoparticles produced with a solid-phase thermal decomposition method were used for the preparation of a conductive paste supporting curing at low temperatures. The conducting paste was prepared by blending fine spherical silver powder and silver nanoparticles with a diameter of 20nm in order to reduce the electric resistivity of the electrodes. Although the viscosity of the conducting paste increased by about 25% after 60 days, it exhibited superior stability to dispersion in comparison to commercial paste. The electric resistivity of the electrode was of the order of 10-6Ωcm at a curing temperature of 200°C. Using this conducting paste, it is possible to print at widths of 20m. The resistivity was further reduced by 1% in the high temperature test at 120°C, by 5% in the high humidity and high temperature test, and by 5% during the thermal shock test at temperatures ranging from -45 to 80°C.

Info:

Periodical:

Key Engineering Materials (Volumes 421-422)

Edited by:

Tadashi Takenaka, Hajime Haneda, Kazumi Kato, Masasuke Takata and Kazuo Shinozaki

Pages:

297-300

DOI:

10.4028/www.scientific.net/KEM.421-422.297

Citation:

Y. Yamamoto and T. Ogihara, "Electrical Properties of Conductive Paste with Silver Nanoparticles and its Application to Flexible Substrates", Key Engineering Materials, Vols. 421-422, pp. 297-300, 2010

Online since:

December 2009

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Price:

$35.00

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