Silver nanoparticles produced with a solid-phase thermal decomposition method were used for the preparation of a conductive paste supporting curing at low temperatures. The conducting paste was prepared by blending fine spherical silver powder and silver nanoparticles with a diameter of 20nm in order to reduce the electric resistivity of the electrodes. Although the viscosity of the conducting paste increased by about 25% after 60 days, it exhibited superior stability to dispersion in comparison to commercial paste. The electric resistivity of the electrode was of the order of 10-6Ωcm at a curing temperature of 200°C. Using this conducting paste, it is possible to print at widths of 20m. The resistivity was further reduced by 1% in the high temperature test at 120°C, by 5% in the high humidity and high temperature test, and by 5% during the thermal shock test at temperatures ranging from -45 to 80°C.