Electrical Properties of Conductive Paste with Silver Nanoparticles and its Application to Flexible Substrates
Silver nanoparticles produced with a solid-phase thermal decomposition method were used for the preparation of a conductive paste supporting curing at low temperatures. The conducting paste was prepared by blending fine spherical silver powder and silver nanoparticles with a diameter of 20nm in order to reduce the electric resistivity of the electrodes. Although the viscosity of the conducting paste increased by about 25% after 60 days, it exhibited superior stability to dispersion in comparison to commercial paste. The electric resistivity of the electrode was of the order of 10-6Ωcm at a curing temperature of 200°C. Using this conducting paste, it is possible to print at widths of 20m. The resistivity was further reduced by 1% in the high temperature test at 120°C, by 5% in the high humidity and high temperature test, and by 5% during the thermal shock test at temperatures ranging from -45 to 80°C.
Tadashi Takenaka, Hajime Haneda, Kazumi Kato, Masasuke Takata and Kazuo Shinozaki
Y. Yamamoto and T. Ogihara, "Electrical Properties of Conductive Paste with Silver Nanoparticles and its Application to Flexible Substrates", Key Engineering Materials, Vols. 421-422, pp. 297-300, 2010