p.309
p.314
p.318
p.322
p.326
p.330
p.334
p.338
p.342
Surface/Subsurface Damage of Yttria Partially Stabilized Zirconia in Grinding Using Monolayer Brazed Diamond Wheel
Abstract:
A new brazed monolayer diamond grinding wheel is developed with the same continuous cutting edge distance on the wheel surface. Surface/subsurface damage of yttria partially stabilized zirconia (Y-PSZ) in grinding using monolayer brazed diamond wheel is analyzed. In this investigation, the influence of the maximum undeformed chip thickness (hm) on material removal mechanism is analyzed. The experiment results show that the ground surface is almost in ductile material removal mode when hm is below the critical value for Y-PSZ, otherwise it will be the combined removal modes of brittle and ductile when hm is above the critical value.
Info:
Periodical:
Pages:
326-329
Citation:
Online since:
March 2010
Authors:
Price:
Сopyright:
© 2010 Trans Tech Publications Ltd. All Rights Reserved
Share:
Citation: