Dimension Accuracy Analysis of a Micro-Punching Mold for IC Packing Bag

Abstract:

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This article is pointed to the dimension accuracy analysis of the micro-punching mold for plastic carrier tape. The parts’ dimensions of the punch were first determined by the specification of the plastic carrier tape. The parts would be manufactured and assembled, and the performance of the punch was tested subsequently. Variation of dimensional accuracy of the plastic carrier tape was inspected to evaluate the performance of the punch. Mean and variance test was conducted under the significance level of α = 0.05. Through these inspections, all the plastic carrier tape met the specifications of dimensional accuracy, which indicated that the precision and performance of the developed micro-punching mold also met the requirement.

Info:

Periodical:

Edited by:

Yuri Chugui, Yongsheng Gao, Kuang-Chao Fan, Roald Taymanov and Ksenia Sapozhnikova

Pages:

477-481

DOI:

10.4028/www.scientific.net/KEM.437.477

Citation:

W. S. Lin and J. C. Lin, "Dimension Accuracy Analysis of a Micro-Punching Mold for IC Packing Bag", Key Engineering Materials, Vol. 437, pp. 477-481, 2010

Online since:

May 2010

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Price:

$35.00

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