Application and Prospects of Packaging Technology of MEMS

Abstract:

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Micro-electromechanical systems is called MEMS for short, it is the product of mutual integration for the micro-electronics and micro-mechanics, which covers mechanical, electrical, physical, biological and other modern technology. MEMS packaging is a key technology that has been developed based on electronic package technology. In order to strengthen the development of packaging process of MEMS, in particular, which are low cost, materials and packaging technology and has an ideal effect. The characteristics of MEMS packaging technology based on MEMS technologies are introduced, and the future development tendency and application of MEMS device packaging are previewed in this dissertation.

Info:

Periodical:

Key Engineering Materials (Volumes 460-461)

Edited by:

Yanwen Wu

Pages:

274-279

DOI:

10.4028/www.scientific.net/KEM.460-461.274

Citation:

X. Z. Feng et al., "Application and Prospects of Packaging Technology of MEMS", Key Engineering Materials, Vols. 460-461, pp. 274-279, 2011

Online since:

January 2011

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Price:

$35.00

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