Application and Prospects of Packaging Technology of MEMS

Abstract:

Micro-electromechanical systems is called MEMS for short, it is the product of mutual integration for the micro-electronics and micro-mechanics, which covers mechanical, electrical, physical, biological and other modern technology. MEMS packaging is a key technology that has been developed based on electronic package technology. In order to strengthen the development of packaging process of MEMS, in particular, which are low cost, materials and packaging technology and has an ideal effect. The characteristics of MEMS packaging technology based on MEMS technologies are introduced, and the future development tendency and application of MEMS device packaging are previewed in this dissertation.

• Periodical: Key Engineering Materials (Volumes 460-461)
• Pages: 274-279
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.460-461.274
• Online since: January 2011
• Authors: Xian Zhang Feng, Liang Ji Chen, Jun Wei Cheng
• Keywords: Interdisciplinary, Micro-Electromechanical System (MEMS), Microelectronics, Packaging Material, Packaging Technology

References

[1] SHACK L, A. MultiPle-view multiPle-scale navigation for micro-assembly/IEEE International Conference on Robotize sand Automation, New Orleans, LA, USA, 2004: 902-907.

[2] Krondorfer Rudolf, Kim Yeong k, Kim Jaeok, et al. Finite Element Simulation of Package Stress in Transfer Molded MEMS Pressure Sensors. Microelectronics Reliability, 2004, 44: 1995-(2002).

DOI: 10.1016/j.microrel.2004.05.020

[3] Bi Gang, Wang Haowei. Characterization and Measurement of Interfacial Reaction in Metal Matrix Composites. Materials for Mechanical Engineering, 1999, 23(5): 1-3.

[4] Timoshenko S P. Analysis of Bi-Metal Thermostats. Journal of Optical Society of America, 1925, 11: 233-255.

[5] Mossakovski, V.I. Compression of elastic bodies under condition of adhesion. PMM, 1963, 27(3): 418-427.

[6] Zhong Z W. Application of the Moiré Interferometry to Thermal Strain Analysis for Electronics Packaging/Proceedings of SPIE, 2002, 4833: 242-248.

[7] Tsai M Y, Hsu C H and Han C N. A note on Suhir's Solution of Thermal Stresses for A Die-Substrate Assembly. Journal of Electronic Packaging, 2004, 126: 115-119.

DOI: 10.1115/1.1648056

[8] MinHang Bao, Analysis and Design Principles of MEMS Devices, Amsterdam: Elsevier, 2005: 102.

[9] Wan Changshen. The Analysis Method of Rolling Bearing. China machine press. Beijing, 1985, 5-168.

[10] Danelle M. Tanner, Norman F. Smith, Lioyd W. Irwin, William P. Eaton et al, MEMS Reliability: Infrastructure, Test Structures, Experiments and Failure Modes, Sandia 2000-0091, Unlimited Release, Jan. (2000).

DOI: 10.2172/750344

[11] Srikar V, T, Stephen D. Senturia. The Design and Analysis of Shock Resistant Microsystems (MEMS)/Transdusers01, Munich, Germany, June 10-14, (2001).

[12] WEI Cheng, JIANG Xiaolin. Study on the Thermal Failure of Metal Substrates in Electronic Packaging. Journal of experimentalmechanics, 2003, 18(1): 17-22.

[13] Fan Zhang, Pengfei Sun. A comparative study on micro plastic deformation behavior in a SiCp/2024Al Composite and its unreining forced matrix alloy . Materials Letters, 2001, (49): 69-74.

DOI: 10.1016/s0167-577x(00)00344-x

[14] G. Meijer,F. Ellyin. Aspects of residual thermal Stress/Strain in particle reinforced metal matrix composites. Composites, 2000, (31): 29-37.

DOI: 10.1016/s1359-8368(99)00060-8

[15] B art Stephen F, Zhang Susan, Rabinovich Vladimir L, et al. Coupled Package-Device Modeling for Microelectro mechanica systems. Microelectronics Reliability, 2000, 40: 1235-1241. -88.

DOI: 10.1016/s0026-2714(00)00010-x

[16] Wen Yujun, Basaran Cemal. An analytical Model for Thermal Stress Analysis of Multi-Layered Microelectronic Packaging . Mechanics of Materials, 2004, 36: 369-385.

DOI: 10.1016/s0167-6636(03)00076-0

[17] LI Ming, HUANG Qing' an, SONG Jing, CHEN Fanxiu, TANG Jieying, Yu Cunjiang. Study of the Thermo mechanical Coupling Effect in COB Packaging Structures. CHINESE JOURNAL OF SENSORS AND ACTUATORS. 2006. Vol9. 5: 1606-1610.

[18] LI Jin, ZHENG Xiaolin, ZHANG Wenxian, CHEN Mo. Lasted development in the field of MEMS packaging. MEMS Device&Technology, 2004, 2: 26-31.