Durability Assessment of Quad Flat No-Lead Package Using Signal Analysis

Abstract:

This paper presents a methodology to determine the durability of Quad Flat No-Lead (QFN) package. The QFN package is useful for improving the reliability of the package. A mechanical fatigue test namely three points bending cyclic test and signal analysis were proposed in this paper. The three points bending cyclic test method is a test assembly that supports a specimen on two anvils or rollers, and symmetrically loads the specimen on the opposite surface with an anvil or roller using micro-tester machine. For strain signal collection, a strain gauge was connected to the dynamic data acquisition system, and it was used for each tested QFN package for determining the response of the captured cyclic strain signal. It was found that the sinusoidal amplitude pattern of signal response has been obtained during the constant three points bending cyclic test. The obtained response signals were then analysed using the Power Spectral Density.

• Periodical: Key Engineering Materials (Volumes 462-463)
• Pages: 236-240
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.462-463.236
• Online since: January 2011
• Authors: Mohd Faridz Mod Yunoh, Shahrum Abdullah, A. Jalar, L. Abdullah, M.F. Abdullah
• Keywords: Durability, Power Spectral Density (PSD), QFN, Strain Signal, Three Point Bending Test

References

[1] K. Hirohata, N. Kawamura, M. Mukai, T. Kawakami, H. Aoki, and K. Takahashi: IEEE Transaction on Electronics Packaging Manufacturing, Vol 25, No. 3 (2002), p.217.

DOI: 10.1109/tepm.2002.804617

[2] S. Abdullah, M.F. Abdullah and A.K. Arifin: Proc. 9th Electronics Packaging Technology Conference, (2007).

[3] R. Schmidt, W. Hosler and R. Tilgner: Proc. IEEE/CPMT Electronic Packaging Technology Conference, (1997), p.188.

[4] S.W. Smith, The Scientist and Engineer's Guide to Digital Signal Processing, 2nd Edition, California Technical Publishing, San Diego (1999).

[5] J.W. Cooley and J.W. Tukey: Math. Comput, Vol. 19 (1965), p.297.

[6] A. Halfpenny and N.W.M. Bishop: Vibration Fatigue, nCode International Ltd., Sheffield UK. (1997).

[7] ASTM B 593 – 96: Standard Test Method for Bending Fatigue Testing for Copper-Alloy Spring Materials (2003), p.1.

[8] JESD22B113: Board Level Cyclic Bending Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products. (2006), p.1.

[9] H. Cui: Proc. IEEE Reliability and Maintainability Symposium, (2005), p.556.

[10] M.P. Norton and D.G. Karczub: Fundamentals of Noise and Vibration Analysis for Engineers, (Cambridge University Press 2003).