Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints

Abstract:

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The aim of this study is to investigate the relationship between the inelastic strain range and the thermal fatigue lives of chip size package solder joints with Sn-Pb and Sn-Ag-Cu solder balls. The inelastic strain range was examined by finite element analysis. In both solder joints, the exponential terms in the inelastic strain range term in the Coffin-Manson equation were evaluated as 1.8 - 2.3. These values are very close to the conventional one used in Sn-Pb and the Pb containing solders. The inelastic strain range is almost proportional to the temperature range in the Sn-Pb solder joint. On the contrary, the inelastic strain range is proportional to approximately the square root of the temperature range in the Sn-Ag-Cu solder joint. The deference depends on the change of the stress-strain hysteresis curve in the thermal cycle.

Info:

Periodical:

Key Engineering Materials (Volumes 462-463)

Edited by:

Ahmad Kamal Ariffin, Shahrum Abdullah, Aidy Ali, Andanastuti Muchtar, Mariyam Jameelah Ghazali and Zainuddin Sajuri

Pages:

76-81

DOI:

10.4028/www.scientific.net/KEM.462-463.76

Citation:

I. Shohji et al., "Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints", Key Engineering Materials, Vols. 462-463, pp. 76-81, 2011

Online since:

January 2011

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Price:

$35.00

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