Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers

K.H. Li; Q. Guo; M.Y. Liu; Y.J. Zhao; D.L. Shi

doi:10.4028/www.scientific.net/KEM.487.169

Paper Titles

Three-Dimensional Simulation of Wheel Topography
p.149

Comparative Study on the Tribological Performance of HFCVD Diamond and DLC Films under Water Lubricating Condition
p.155

Development of a Multiple Micro Diamond Wheel-Tools
p.160

First Principle Calculations on Structures and Properties of Diamond-Like B₂(CN)₃ Compounds
p.164

Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers
p.169

Particle Flow Simulation on Semi-Fixed Abrasive Tool Processing
p.175

Effect of Ultrasonic on Coating Performances of Electroplated Diamond Tools
p.180

Finite Element Analysis of Stress Distributions on the Diamond Pick
p.184

Experiment Study on Abrasives Performance on Vitrified CBN Wheel
p.189

HomeKey Engineering MaterialsKey Engineering Materials Vol. 487Influence of Pore-Forming Agent on the Performance...

Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers

Abstract:

Back grinding is the key working procedure in the silicon wafer manufacturing process. Ground silicon wafers ought to have low subsurface damage layer thickness (SSD ) and surface roughness value. It requires that the wheel should have high self-sharpening ability and consistent performance. In this paper, the research on pore-forming agent in order to improve the wheel’s self-sharpening ability of the resin-bond diamond grinding was conducted. The research includes the pore-forming mechanism of various pore-forming agent, the influence of pore-forming agent’s type and the effect on the bond’s strength, the influence of pore-forming agent on the grinding performance of the wheel. Moreover, it examines the improved grinding wheel’s grinding effect by grinding tests.

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Periodical:

Key Engineering Materials (Volume 487)

Pages:

169-174

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.487.169

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Online since:

July 2011

Authors:

K.H. Li, Q. Guo, M.Y. Liu, Y.J. Zhao, D.L. Shi

Keywords:

Back-Grinding, Diamond Grinding Wheel, Pore-Forming Agent, Resin Bond, Silicon Wafer

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