Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers

Abstract:

Article Preview

Back grinding is the key working procedure in the silicon wafer manufacturing process. Ground silicon wafers ought to have low subsurface damage layer thickness (SSD ) and surface roughness value. It requires that the wheel should have high self-sharpening ability and consistent performance. In this paper, the research on pore-forming agent in order to improve the wheel’s self-sharpening ability of the resin-bond diamond grinding was conducted. The research includes the pore-forming mechanism of various pore-forming agent, the influence of pore-forming agent’s type and the effect on the bond’s strength, the influence of pore-forming agent on the grinding performance of the wheel. Moreover, it examines the improved grinding wheel’s grinding effect by grinding tests.

Info:

Periodical:

Edited by:

Feng Zhu, Xipeng Xu and Renke Kang

Pages:

169-174

DOI:

10.4028/www.scientific.net/KEM.487.169

Citation:

K.H. Li et al., "Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers", Key Engineering Materials, Vol. 487, pp. 169-174, 2011

Online since:

July 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.