Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy

Abstract:

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Cu-Sn-Ti brazing alloys are gaining importance as active brazing alloys for brazing diamond tools. The microstructure at the interface between diamond or Ti-coated diamond grits and Cu-Sn-Ti brazing alloy and bonding strength have been investigated in this paper. The results show that TiC layer forms between diamond and alloy matrix during the brazing process and Sn- and Ti-based intermetallic phase forms between TiC and the bonding matrix. And compound SnTi3 forms between the Ti-coated diamond grits and Cu-Sn-Ti brazing alloy. Furthermore, the bonding strength between Ti-coated diamond grits and brazing alloy is higher than that between diamond grits and brazing alloy.

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Periodical:

Edited by:

Feng Zhu, Xipeng Xu and Renke Kang

Pages:

199-203

DOI:

10.4028/www.scientific.net/KEM.487.199

Citation:

Y. Chen et al., "Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy", Key Engineering Materials, Vol. 487, pp. 199-203, 2011

Online since:

July 2011

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$35.00

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