Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy
Cu-Sn-Ti brazing alloys are gaining importance as active brazing alloys for brazing diamond tools. The microstructure at the interface between diamond or Ti-coated diamond grits and Cu-Sn-Ti brazing alloy and bonding strength have been investigated in this paper. The results show that TiC layer forms between diamond and alloy matrix during the brazing process and Sn- and Ti-based intermetallic phase forms between TiC and the bonding matrix. And compound SnTi3 forms between the Ti-coated diamond grits and Cu-Sn-Ti brazing alloy. Furthermore, the bonding strength between Ti-coated diamond grits and brazing alloy is higher than that between diamond grits and brazing alloy.
Feng Zhu, Xipeng Xu and Renke Kang
Y. Chen et al., "Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy", Key Engineering Materials, Vol. 487, pp. 199-203, 2011