Recovery of Electroplated Diamond Tool with Thermal Shock Method

Ai Bing Yu; L. Wu; B.Y. Gao

doi:10.4028/www.scientific.net/KEM.487.215

Paper Titles

Manufacturing and Experimental Research of Fine Grain Diamond Grinding Wheel Based on Magnetic Field Controlling
p.195

Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy
p.199

Research on the CAD Technology of Resin-Bonded Diamond Abrasive Tool Based on Quality Control
p.204

Simulation of Grinding Wheel with Random Three-Dimensional Abrasive and Microporous Bond
p.209

Recovery of Electroplated Diamond Tool with Thermal Shock Method
p.215

Self-Sharpening Abrasive Composite Bulks with PCBN Grains
p.220

Research on the Milling Toughness of Black Silicon Carbide and the Repeatability of the Testing Results
p.225

Performance of Monolayer Brazed CBN Wheels Manufactured with Rare Earth Lanthanum Modified Ag-Cu-Ti Filler
p.229

Surface Characterization of Silicon Wafers Polished by Three Different Methods
p.233

HomeKey Engineering MaterialsKey Engineering Materials Vol. 487Recovery of Electroplated Diamond Tool with...

Recovery of Electroplated Diamond Tool with Thermal Shock Method

Abstract:

When diamond abrasive layer becomes thinner, remaining expensive diamond grits will lose their cutting ability. The recovery of waste diamond tools can realize the recycling of material, is one kind of green manufacturing. Taken electroplated diamond tools for example, key technical problems for diamond tool recovery were discussed in this study. A thermal shock method was proposed for electroplated diamond tools recycling processes. Based on heat elastic-plastic theory, the stress state between abrasive layer and substrate of electroplated diamond tools was analyzed. Thermal shock processes of electroplated diamond tools were simulated with finite element method. Thermal shock experiments of electroplated diamond tools were carried out with experimental electric furnace. The results indicate that there exists stress variation between abrasive layer and tool substrate interface during thermal shock operation. The stress change will result in the interface cracking and the peeling of abrasive layers from substrate. There exists obvious stress gradient between abrasive layer and substrate interface. The stress extreme value occurs on the area of abrasive layer transition region, the corner or end of abrasive layer. Experimental results prove that the separating of abrasive layer and the tool substrate using thermal shock method is feasible.