Study on Compound Machining of Polyurethane Polishing Pad and Cluster Abrasive Brush Based on MR Effect

Min Li; Qiu Sheng Yan; Jia Bin Lu; Jing Fu Chai

doi:10.4028/www.scientific.net/KEM.487.238

Paper Titles

Self-Sharpening Abrasive Composite Bulks with PCBN Grains
p.220

Research on the Milling Toughness of Black Silicon Carbide and the Repeatability of the Testing Results
p.225

Performance of Monolayer Brazed CBN Wheels Manufactured with Rare Earth Lanthanum Modified Ag-Cu-Ti Filler
p.229

Surface Characterization of Silicon Wafers Polished by Three Different Methods
p.233

Study on Compound Machining of Polyurethane Polishing Pad and Cluster Abrasive Brush Based on MR Effect
p.238

Study on Lubricating Behavior in Chemical Mechanical Polishing
p.243

Processing of Lapping Track in Dual Rotated Plates Eccentric Lapping Mode
p.248

Research on Subsurface Damage After Abrasives and Fixed-Abrasive Lapping of K9 Glass
p.253

Study on Machining Process of Lapping for BK7 Glass
p.257

HomeKey Engineering MaterialsKey Engineering Materials Vol. 487Study on Compound Machining of Polyurethane...

Study on Compound Machining of Polyurethane Polishing Pad and Cluster Abrasive Brush Based on MR Effect

Abstract:

Method of compound machining is used to process single crystal silicon and SrTiO3 ceramic substrates, and the factors on effects of compound machining are studied such as magnetic field intensity, processing time, rotating speed of lapping plate and lapping pressure. The results show that the roughness of work pieces processed by compound machining are smaller than that by lapping based on cluster MR effect and polyurethane pad polishing process, while the material removal rate is higher than polyurethane pad polishing process, therefore, compound machining shows its synergistic effect between lapping based on cluster MR effect and polyurethane pad polishing process. The type and properties of workpiece material, and machining parameters both have a significant impact on the roughness and material removal rate of compound machining process of polyurethane polishing pad and cluster abrasive brush based on MR effect.

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Periodical:

Key Engineering Materials (Volume 487)

Pages:

238-242

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.487.238

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Online since:

July 2011

Authors:

Min Li, Qiu Sheng Yan, Jia Bin Lu, Jing Fu Chai

Keywords:

Compound Machining, Lapping Based on Cluster MR Effect, Polyurethane Pad Polishing Process

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