Study on Compound Machining of Polyurethane Polishing Pad and Cluster Abrasive Brush Based on MR Effect

Abstract:

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Method of compound machining is used to process single crystal silicon and SrTiO3 ceramic substrates, and the factors on effects of compound machining are studied such as magnetic field intensity, processing time, rotating speed of lapping plate and lapping pressure. The results show that the roughness of work pieces processed by compound machining are smaller than that by lapping based on cluster MR effect and polyurethane pad polishing process, while the material removal rate is higher than polyurethane pad polishing process, therefore, compound machining shows its synergistic effect between lapping based on cluster MR effect and polyurethane pad polishing process. The type and properties of workpiece material, and machining parameters both have a significant impact on the roughness and material removal rate of compound machining process of polyurethane polishing pad and cluster abrasive brush based on MR effect.

Info:

Periodical:

Edited by:

Feng Zhu, Xipeng Xu and Renke Kang

Pages:

238-242

DOI:

10.4028/www.scientific.net/KEM.487.238

Citation:

M. Li et al., "Study on Compound Machining of Polyurethane Polishing Pad and Cluster Abrasive Brush Based on MR Effect", Key Engineering Materials, Vol. 487, pp. 238-242, 2011

Online since:

July 2011

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$35.00

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