Densification Mechanism of the Low Temperature Co-Fired Glass-Ceramic Substrate

Abstract:

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In this paper, application of multilayered circuit substrates has been studied, the glass ceramic (50%Al2O3-50%glass) with low temperature co-fired and good performance as the raw material was used, by means of calculating the apparent activation energy of densification in the experiment and observing the SEM images of glass ceramic substrate section, the densification mechanism of glass ceramic substrate sintering is analyzed.

Info:

Periodical:

Edited by:

Yiwang Bao, Danyu Jiang, Li Tian and Jianghong Gong

Pages:

122-125

DOI:

10.4028/www.scientific.net/KEM.492.122

Citation:

Q. He and Z. T. Geng, "Densification Mechanism of the Low Temperature Co-Fired Glass-Ceramic Substrate", Key Engineering Materials, Vol. 492, pp. 122-125, 2012

Online since:

September 2011

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Price:

$35.00

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