Densification Mechanism of the Low Temperature Co-Fired Glass-Ceramic Substrate

Qing He; Zhi Ting Geng

doi:10.4028/www.scientific.net/KEM.492.122

Paper Titles

Investigation of Microstructure and Mechanical Property of the Fe₃Al/Al₂O₃ Composites Fabricated by Mechanical Alloying Process and Hot-Pressing Process
p.102

Comparison of the Low Temperature Degradation Properties of Two Y-TZP Ceramics for Dental Applications
p.107

Microstructure Characteristics of the Black-Glazed Shreds Excavated from the Qingliangsi Kiln
p.112

Relationship between the Conductivity of Supernatant of 3Y-TZP Powder and Sintering Properties of its Ceramics
p.118

Densification Mechanism of the Low Temperature Co-Fired Glass-Ceramic Substrate
p.122

Lateral Confinement and Ballistic Performance of TiC-TiB₂ Composites
p.126

Ballistic Performance of TiC-TiB₂ Composite Armour under the Impact of Long-Rod Tungsten Alloy Projectiles of 1.4 Km·s^-1
p.132

Microwave Sintering of SiCp/Al Composite
p.138

Structure and Characteristics of Spherical-Pore Silicon Carbide
p.142

HomeKey Engineering MaterialsKey Engineering Materials Vol. 492Densification Mechanism of the Low Temperature...

Densification Mechanism of the Low Temperature Co-Fired Glass-Ceramic Substrate

Abstract:

In this paper, application of multilayered circuit substrates has been studied, the glass ceramic (50%Al₂O₃-50%glass) with low temperature co-fired and good performance as the raw material was used, by means of calculating the apparent activation energy of densification in the experiment and observing the SEM images of glass ceramic substrate section, the densification mechanism of glass ceramic substrate sintering is analyzed.

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Key Engineering Materials (Volume 492)

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122-125

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.492.122

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Online since:

September 2011

Authors:

Qing He, Zhi Ting Geng

Keywords:

Apparent Activation Energy, Glas Ceramics, Sintering Densification

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