Heat Transfer Analysis and Optimization for Wafer System of Laser Annealing Equipment

Abstract:

This paper provides heat transfer modeling analysis and parameter optimization for wafer system of laser annealing equipment. Heat transfer models are established at axial and radial directions. With the help of programming calculation, the relation between heat flux of radiation and distance of adjacent layers can be analyzed. In order to minimize heat transfer interference on the motor system, optimized parameters are selected. Performance of certain selection is verified by FEA simulation and experiment data.

• Periodical: Key Engineering Materials (Volume 499)
• Pages: 91-95
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.499.91
• Online since: January 2012
• Authors: Zi Guang Rong, Z.J. Wu, P.F. Feng, D.W. Yu
• Keywords: Insulation Design, Laser Annealing, Semiconductor Manufacturing, Wafer System

References

[1] Y.F. Zhang: Semiconductor Integrated Circuit Manufacturing Technology, Beijing: (Higher Education Press, 2006).

[2] L.Q. Xian, X.W. Gao: Research and Exploration Vol. 26(2007), pp.14-16.

[3] Q.G. Zhou: IC application Vol. 05 (2008), pp.45-46.

[4] H.B. Wang: China Integrated Circuit Vol. 03 (2008), pp.17-30.

[5] K.W. Zhang: World Manufacturing Engineering & Market Vol. 1 (2008), pp.88-91.

[6] B.S. Wang: Industrial Furnace Design Manual, Beijing: (China Machine Press, 2010).

[7] M.X. Guo: Industrial Furnace, Beijing: (Metallurgical Industry Press, 2002).