Study on Curing Process of Resin Nanocomposites

Chuan Sheng Wang; Rui Qin Wang; Yuan Wang; Yong Xiang Fu

doi:10.4028/www.scientific.net/KEM.501.349

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 501Study on Curing Process of Resin Nanocomposites

Study on Curing Process of Resin Nanocomposites

Abstract:

In order to get an optimum performance of composite materials, it is of crucial importance to select the best curing process, on condition that resin and curing agent system is determined. In this paper, we studied the curing non-isothermal dynamics of the nmSi02 / epoxy resin system, and calculated the activation energy and reaction series, according to Kissinger, Ozawa and Crane method. We found out the peak temperature, the theory gel temperature and the theory curing temperature with extrapolation as heating rate β= 0. Finally we determined the best curing process range of the system.

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Periodical:

Key Engineering Materials (Volume 501)

Pages:

349-354

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.501.349

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Online since:

January 2012

Authors:

Chuan Sheng Wang, Rui Qin Wang, Yuan Wang, Yong Xiang Fu

Keywords:

Curing Process, Epoxy Resin (ER), Resin Nanocomposites

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