Particle/Substrate Interactions during Thermal Spraying

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Periodical:

Key Engineering Materials (Volumes 53-55)

Edited by:

P.J. Darragh and R.J. Stead

Pages:

499-504

DOI:

10.4028/www.scientific.net/KEM.53-55.499

Citation:

D. Wang and C.C. Berndt, "Particle/Substrate Interactions during Thermal Spraying", Key Engineering Materials, Vols. 53-55, pp. 499-504, 1991

Online since:

January 1991

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$35.00

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