Various Designs of Meander Inductor and their Influence on LC Resonant Displacement Sensor

Nelu Blaž; Goran Mišković; Andrea Marić; Mirjana S. Damnjanović; Goran Radosavljević; Ljiljana Živanov

doi:10.4028/www.scientific.net/KEM.543.235

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 543Various Designs of Meander Inductor and their...

Various Designs of Meander Inductor and their Influence on LC Resonant Displacement Sensor

Abstract:

This paper deals with various configurations of meander inductor and their influence on characteristics of passive LC displacement sensor. Passive techniques use LC resonator to measure the parameters of interest remotely without an on-board power supply. Developed LC sensor comprises a fixed meander inductor and a movable module of mender inductor - interdigital capacitor resonant circuit, thereby causing the sensor resonant frequency to be displacement - dependent. The inductor and sensor circuits have been fabricated in PCB technology. The main goal was to find the optimal position for measurement connection pads on fixed meander inductor PCB as well as position of connection line between mender inductor and interdigital capacitor on PCB board with LC circuit. Measurements were realized on Impedance Analyzer (HP4191A) in frequency range from 10 MHz to 30 MHz, with 100 kHz step for each configuration of meander inductor. As results of these measurements the best configuration and the best sensor sensitivity for both mender inductors was determined.

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Periodical:

Key Engineering Materials (Volume 543)

Pages:

235-238

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.543.235

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Online since:

March 2013

Authors:

Nelu Blaž, Goran Mišković, Andrea Marić, Mirjana S. Damnjanović, Goran Radosavljević, Ljiljana Živanov

Keywords:

Displacement Sensor, Meander Inductor Configuration, PCB Technology

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References

[1] N. Blaž, G. Mišković, A. Marić, M. Damnjanović, G. Radosavljević, Lj. Živanov, Modeling and Characterization of LC Displacement Sensor in PCB Technology, The 35th International Spring Seminar on Electronics Technology (ISSE 2012), pp.168-169.

DOI: 10.1166/sl.2013.2935

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DOI: 10.1109/jsen.2009.2030974

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