Multiple Crack Propagation with Dual Boundary Element Method in Stiffened and Reinforced Full Scale Aeronautic Panels

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In this work, the performance of a new methodology, based on the Dual Boundary Element Method (DBEM) and applied to reinforced cracked aeronautic panels, is assessed. Such procedure is mainly based on two-dimensional stress analyses, whereas the three-dimensional modelling, always implemented in conjunction with the sub-modelling approach, is limited to those situations in which the so-called secondary bending effects cannot be neglected. The connection between the different layers (patches and main panel) is realised by rivets: a peculiar original arrangement of the rivet configuration in the two-dimensional DBEM model allows to take into account the real in-plane panel stiffness and the transversal rivet stiffness, even with a two dimensional approach. Different in plane loading configurations are considered, depending on the presence of a biaxial or uniaxial remote load. The nonlinear hole/rivet contact, is simulated by gap elements when needed. The most stressed skin holes are highlighted, and the effect of through the thickness cracks, initiated from the aforementioned holes, is analysed in terms of stress redistribution, SIF evaluation and crack propagation. The two-dimensional approximation for such kind of problems is generally not detrimental to the accuracy level, due the low thickness of involved panels, and is particularly efficient for studying varying reinforcement configurations, where reduced run times and a lean pre-processing phase are prerequisites.The accuracy of the proposed approach is assessed by comparison with Finite Element Method (FEM) results and experimental tests available in literature.This approach aims at providing a general purpose prediction tool useful to improve the understanding of the fatigue resistance of aeronautic panels.KEYWORDSDBEM, full scale aeronautic panel, 2D/3D crack growth, MSD, doubler-skin assembly, damage tolerance

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129-155

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July 2013

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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