Ultra-Precision Fly Cutting Experimental Study of Semiconductor Laser Heat Sink

Abstract:

Laser cooling is one of the critical problems in the research of high power semiconductor lasers. This paper provides an overview of microchannel heat sink which is used to cool the high power semiconductor lasers. The method of polishing after cutting is the current processing method of the heat sink, which is because the ordinary cutting method cannot meet the requirements of high quality of surface and edge burrs. This paper proposes ultra-precision fly cutting method for heat sink machining to omit the polishing processing to improve the machining efficiency, and verifies by experiments that the feasibility of the processing method and the edge quality improved by workpiece superposition processing method.

• Periodical: Key Engineering Materials (Volumes 579-580)
• Pages: 167-170
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.579-580.167
• Online since: September 2013
• Authors: Yu Long Chen, Hai Tao Liu, Ya Zhou Sun, Qiang Zhang, Ying Chun Liang
• Keywords: Burrs, Edge, Heat Sink, Ultra-Precision Fly Cutting

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