Effects of Small Amount Addition of Rare Earth Y on Microstructure and Property of Sn3.0Ag0.5Cu Solder

Abstract:

In the present work, effect of adding small amount of Y on the microstructure, physical and mechanical properties of Sn3.0Ag0.5Cu solder has been investigated. The purpose is to understand if the heavy rare earth Y has similar effect as light rare earth Ce or La on improving properties of SnAgCu lead-free solder. The results indicated that adding small amount of Y can evidently improve the wettability, mechanical strength and creep rupture life of the Sn3.0Ag0.5Cu solder alloy. It is pointed out that proper Y content in the Sn3.0Ag0.5Cu solder alloy should be in a range of 0.05~0.25wt%. Moreover, It is felt that the increase in mechanical strength may be related to the refining of IMCs of the solder due to the addition of small amount of Y.

• Periodical: Key Engineering Materials (Volume 584)
• Pages: 3-8
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.584.3
• Online since: September 2013
• Authors: Hui Li
• Keywords: Lead-Free Solder, Mechanical Property, Microstructure, Rare Earth, SnAgCu

References

[1] Directive 2002/95/EC, The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, The European Parliament and of the Council of the European Union, 2003. 27(1).

[2] K.S. Kim, S.H. Huh, K. Suganuma, Microelectro-n[J], Reliability, 2003, 43 (2): 259–267.

[3] Z.G. Chen, Y.W. Shi, Z.D. Xia, Y.F. Yan, Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints[J], J. Electron. Mater. 2002, 31 (10): 1122–1128.

DOI: 10.1007/s11664-002-0052-4

[4] Z.G. Chen, Y.W. Shi, Z.D. Xia, Y.F. Yan, Properties of lead-free solder SnAgCu containing minute amounts of rare earth[J] , J. Electron. Mater. 2003, 32 (4): 235–243.

DOI: 10.1007/s11664-003-0215-y

[5] Z.G. Chen, Y.W. Shi, Z.D. Xia, Constitutive. Relations on Creep for SnAgCuRE Lead-Free Solder Joints [J], J. Electron. Mater. 2004, 33 (9): 964–971.

DOI: 10.1007/s11664-004-0023-z

[6] B. Li, Y.W. Shi, Y.P. Lei, F. Guo, Z.D. Xia, B. Zong, Effect of praseodymium on the microstructure and properties of Sn3. 8Ag0. 7Cu solder[J], J. Electron. Mater. 2005, 34(3): 217–224.

[7] Z.D. Xia, Z.G. Chen, Y.W. Shi, N. Mu, N. Sun, Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder[J], J. Electron. Mater. 2002, 31 (6): 564–567.

DOI: 10.1007/s11664-002-0126-3

[8] D.Q. Yu, J. Zhao, L. Wang, Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare element[J].J. Alloys Compd. 2004, 376 (1–2): 170–175.

DOI: 10.1016/j.jallcom.2004.01.012

[9] C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, The properties of Sn-9Zn lead- free solder alloys doped with trace rare earth elements[J], Mater. Sci. Eng. 2004, R44 (1): 1–44.

DOI: 10.1007/s11664-002-0184-6

[10] JIS Z 3198-5, Test Methods for Lead-Free Solders, Part 5, Methods for Tensile Tests and Shear Tests on Solder Joints, Japanese Industrial Standards Committee, (2003).

[11] K. Zeng, K.N. Tu, SnPb solder reaction in flip chip technology [J], Mater. Sci. Eng. 2002, R38 (2): 55–105.

[12] W.M. Xiao, Y.W. Shi, Y.P. Lei, Z.D. Xia, F. Guo, Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys[J]. J. Elect. Mater. 2006, 35 (5): 1095–1103.

DOI: 10.1007/bf02692572