Study on Fixed Abrasive Lapping Hard and Brittle Materials with Brazed Micro Powder Diamond Disk

Quan Cheng Li; Jian Yun Shen; Cong Fu Fang; Xi Peng Xu

doi:10.4028/www.scientific.net/KEM.589-590.451

Paper Titles

Experimental Study and Simulation Analysis on Ball-End Cutter Milling Titanium Alloy Based on the Geometric Parameters Optimization
p.427

A Scientific Method of Tool Life Evaluation for Large Cylinder Section Cutting Database
p.433

Research on Geometric Modeling Method of Finishing Milling Cutter with Fir-Slot
p.438

The Polishing Process of Cylindrical Rollers by Using a Double-Side Lapping Machine
p.447

Study on Fixed Abrasive Lapping Hard and Brittle Materials with Brazed Micro Powder Diamond Disk
p.451

Study on the Machining Parameters in Polishing Single-Crystal SiC Wafers with SG Films
p.457

The Adherence Mechanism of Superalloy Honing Oilstone
p.464

Experiment Research Progresses of Single Abrasive Grain Grinding
p.470

Analysis of Path Distribution in Lapping and Polishing with Single Fixed Abrasive
p.475

HomeKey Engineering MaterialsKey Engineering Materials Vols. 589-590Study on Fixed Abrasive Lapping Hard and Brittle...

Study on Fixed Abrasive Lapping Hard and Brittle Materials with Brazed Micro Powder Diamond Disk

Abstract:

In this study, two different arrangement lapping disks fixed with brazed diamond pellets were used to lap silicon wafer and alumina ceramic. The effects of the surface morphology, roughness, and removal rate of workpiece caused by lapping pressure, lapping time, workpiece velocity, and disc arrangement were operated with serials experiments. The results of the researches provided guidance for fixed abrasive lapping of hard and brittle materials with the brazed micro powder diamond disk.

You might also be interested in these eBooks

Advances in Machining and Manufacturing Technology XII

View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 589-590)

Pages:

451-456

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.589-590.451

Citation:

Cite this paper

Online since:

October 2013

Authors:

Quan Cheng Li, Jian Yun Shen, Cong Fu Fang, Xi Peng Xu

Keywords:

Brazed, Brittle Materials, Diamond, Fixed Abrasive Lapping, Hard Material

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Ligang Bai. Study on planarization maching of sapphire substrates used for illumination. [M]. Jiangsu University, Jiangsu, China, (2012).

Google Scholar

[2] Liming Li, Mao Li, Yongwei Zhu. Fixed abrasive lapping and polishing: present situation and prospect. Diamond & Abrasive Engineering. Vol. 173(2009), p.17.

Google Scholar

[3] Velden P V D, Chemical mechanical polishing with fixed abrasives using different sub pads to optimize wafer uniformity. Microelectronic Engineering, 2000, Vol. 50 (2000), p.41.

DOI: 10.1016/s0167-9317(99)00262-2

Google Scholar

[4] Dunwen Zuo, Yuli Sun, Yufei Zhao, etal. Basic research on Polishing with Ice Bonded Nano abrasive Pad. Journal of Vacuum Science & Technology. Vol. 27(2009), p.1514.

DOI: 10.1116/1.3125272

Google Scholar

[5] Jianxiu Su. Study on material removal mechanism of wafer chemical mechanical polishing in IC manufacturing. [Doctor Thesis]. Dalian University of technology, Dalian, China, (2006).

Google Scholar

[6] Gang Wang. Fabrication and performance evaluation of brazed fine powder diamond grinding and milling tool. [Master Thesis]. Huaqiao University, Xiamen, China, (2012).

Google Scholar

[7] Zhidan Zeng. Effects of impurities on the mechanical properties of Czochralski silicon. [Doctor thesis]. Zhejiang University, Zhejiang, China, (2011).

Google Scholar