Simulation of Edge Chipping in Laser-Assisted Milling of Silicon Nitride Ceramics Using the XEFM

Xue Feng Wu; Teng Fei Gao; Yang Wang

doi:10.4028/www.scientific.net/KEM.589-590.511

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 589-590Simulation of Edge Chipping in Laser-Assisted...

Simulation of Edge Chipping in Laser-Assisted Milling of Silicon Nitride Ceramics Using the XEFM

Abstract:

Theoretical, experimental and simulation researches are investigated to study the phenomenon of edge chipping in laser assisted milling (LAML) of silicon nitride ceramics. To consider the crack evolution and influencing factors of edge chipping, the Extended Finite Element Method (XFEM) is used to model the process of chipping crack with the advantage of independent of the mesh and needless to remesh with the crack growth. The chipping width measured from experiments are loaded as initial boundary conditions to build the XFEM model, and the results show the edge chipping reduces with cutting forces decreasing and edge toughness increasing. The model reveals the edge chipping of workpiece reduces at elevated temperature through softening and toughening mechanisms.

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Key Engineering Materials (Volumes 589-590)

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511-516

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https://doi.org/10.4028/www.scientific.net/KEM.589-590.511

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October 2013

Authors:

Xue Feng Wu, Teng Fei Gao, Yang Wang

Keywords:

Edge Chipping, Extended Finite Element Method (XFEM), Laser Assisted Milling, Silicon Nitride Ceramic

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