Rotary Ultrasonic Machining of Sapphire: Feasibility Study and Designed Experiments

Cheng Long Zhang; Ping Fa Feng; Zhi Jian Pei; Wei Long Cong

doi:10.4028/www.scientific.net/KEM.589-590.523

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 589-590Rotary Ultrasonic Machining of Sapphire:...

Rotary Ultrasonic Machining of Sapphire: Feasibility Study and Designed Experiments

Abstract:

Sapphire, widely used in high-speed integrated-circuit chips, thin-film substrates, and various electronic components, is regarded as one of the most difficult to cut materials owing to its great hardness and low fracture toughness. Rotary ultrasonic machining (RUM) has been regarded as an effective processing method for hard and brittle materials. In this paper, RUM process is introduced into the drilling of sapphire for the first time. The feasibility to machine sapphire using RUM is studied. Moreover, results of a designed experimental study into RUM of sapphire are presented to discuss the main effects as well as interaction effects of process parameters (ultrasonic power, spindle speed, and feedrate) on outputs. The process outputs investigated include cutting force and edge chipping size.

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Periodical:

Key Engineering Materials (Volumes 589-590)

Pages:

523-528

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.589-590.523

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Online since:

October 2013

Authors:

Cheng Long Zhang, Ping Fa Feng, Zhi Jian Pei, Wei Long Cong

Keywords:

Cutting Force, Drilling, Edge Chipping Size, Rotary Ultrasonic Machining, Sapphire

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