Working Fluid Inventory Effect on Heat Transfer Performance of a Grooved Micro Heat Pipe

Article Preview

Abstract:

As a highly efficient heat transfer component, a micro heat pipe (MHP) has been widely applied to the situations with high heat flux concentration. However, a MHPs heat transfer performance is affected by many factors, among which, working fluid inventory has great influence on the security, reliability and frost resistance of its heat transfer performance. In order to determine the appropriate working fluid inventory for grooved MHPs, this paper first analyzed the working principle, major heat transfer limits and heat flux distribution law of grooved MHPs in electronic chips with high heat flux concentration, then established a mathematic model for the working fluid inventory in grooved MHPs. Finally, with distilled water being the working fluid, a series of experimental investigations were conducted at different temperatures to test the heat transfer performances of grooved MHPs, which were perfused with different inventories and with different adiabatic section lengths. The experimental results show that when the value of α is roughly within 0.40±0.05, a grooved MHP can acquire its best heat transfer performance, and the working fluid inventory can be determined by the proposed mathematic model. Therefore this study solves the complicated problem of determining appropriate working fluid inventory for grooved MHPs.

You might also be interested in these eBooks

Info:

Periodical:

Key Engineering Materials (Volumes 589-590)

Pages:

559-564

Citation:

Online since:

October 2013

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] D.K. Chen: Chinese Journal of Low Temperature Physics Vol. 27 (2005), pp.255-262.

Google Scholar

[2] A.I. Uddin, C.M. Feroz: Heat Mass Transfer, Vol. 46 (2009), pp.113-118.

Google Scholar

[3] W. Srimuang, S. Rittidech, B. Bubphachot: Journal of Mechanical Science and Technology, Vol. 23 (2009), pp.2548-2554.

DOI: 10.1007/s12206-009-0703-y

Google Scholar

[4] J.H. Wu, Y. Tang, L.S. Lu: Journal of Central South University of Technology, Vol. 18 (2011), pp.2170-2175.

Google Scholar

[5] Y.C. Chiang, J.J. Chieh, C.C. Ho: Nanoscale Research Letters, Vol. 7 (2012), pp.322-327.

Google Scholar

[6] Z.C. Liu, D.X. Gai, W. Liu: Journal of Engineering Thermophysics, Vol. 31 (2010), pp.487-490.

Google Scholar

[7] X.B. Li, J.H. Guo, S.G. Wang, et al: Chinese Journal of Vacuum Science and Technology, Vol. 31 (2011), pp.187-193.

Google Scholar

[8] Z.Q. Long, P. Zhang: Ciese Journal, Vol. 63 (2012), pp.69-74.

Google Scholar

[9] X.B. Li, Z.M. SHI, S.G. Wang, et al: Key Engineering Materials, Vol. 499 (2012), pp.21-26.

Google Scholar