Microwave Emission of Carbon Fibres during Electrical Breakdown

Abstract:

A new method of reliability monitoring of electrical devices based on carbon fibres is presented. Due to the thermo-mechanical stress on electronic circuits a loss of fibre network integrity can take place and potential difference may appear between the edges of broken carbon fibres. This potential difference causes an intensive field-emission from surfaces of these broken carbon fibres and an acceleration of emitted electrons. Due to the acceleration of electrons a microwave emission is generated. A CFRP was used to simulate the behaviour of a carbon based electronic device. The sequence of microwave impulses was detected in a frequency bandwidth from 8 to 12 GHz. The rise time of detected microwave impulses is about of few nanoseconds. This time is in agreement with crack formation time in carbon fibre. The correlation between the change of electrical resistance of composites and microwave impulses by fibres fracture is observed. Thus, the breakdown of current that flows through carbon fibres induces detectable microwave emission. That means that defects in electrical circuits can be wireless detected online.

• Periodical: Key Engineering Materials (Volume 605)
• Pages: 544-547
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.605.544
• Online since: April 2014
• Authors: Alexander Aman*, Sören Majcherek, Sören Hirsch
• Keywords: Breakage, Crack Detection, Health Monitoring, Measurement, Microwave Emission

References

[1] M. Paradise, T. Goswami: Mater. Design, 28 (2007), p.1477

[2] S. Majcherek, T. Leneke, S. Hirsch, B. Schmidt, in: Smart systems integration, edited by T. Gessner, VDE Verlag, Berlin (2008), p.436

[3] S. Hirsch, M.-P. Schmidt, B. Schmidt (Eds.), in: Electronics Systemintegration Technology Conference, edited by T. Zerna, Dresden (2006)

[4] S. Hirsch, B. Schmidt: MRS Online Proceedings Library, 969 (2006).

[5] B. Wunderle, B. Michel: Microelectron. Reliab., 46 (2006), p.1685

[6] N. Meyendorf, B. Michel, G.Y. Baaklini, in: NDE for Health Monitoring and Diagnostics, SPIE, edited by T. Kundu, San Diego (2003), p.47

[7] A.R. Fix, W. Nüchter, J. Wilde: Solder. Surf. Mt. Tech., 20 (2008), p.13

[8] S. Fischer, H. Beyer, R. Janke, J. Wilde: Microsyst. Technol., 12 (2005), p.69

[9] M.M. Tehranchi, H. Eftekhari, M. Ranjbaran: Sens. Lett., 11 (2013), p.125

[10] Y. Choua, L. Santandrea, Y. Le Bihan, C. Marchand: Sens. Lett., 7 (2009), p.475

[11] B. Hou, W. Zhu, J. Jie: Sens. Lett., 10 (2012), p.1645

[12] S. Majcherek, S. Hirsch, B. Schmidt, T. Kundu, in: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, SPIE, edited by T. Kundu San Diego (2010), p.76501

[13] W. Chen, X.P. Dong, X.F. Zhu, F. Yang, X.Q. Hu: Sens. Lett., 10 (2012), p.1562

[14] G. Gruner: J. Mater. Chem., 16 (2006), p.3533

[15] Ph. Avouris, T. Hertel, R. Martel, T. Schmidt, H.R Shea, R.E Walkup: App. Surf. Sci., 141 (1999), p.201

[16] S. Saito: Science, 278 (1997), p.77

[17] B. Chandra, in: Luminescence of Solids, edited by D. Vij (Ed.) Springer US, New York NY (1998), p.361

[18] J.T. Dickinson: J. Vac. Sci. Technol., 20 (1982), p.436.

[19] J. Dickinson, E. Donaldson, M. Park: J. Mater. Sci., 16 (1981), p.2897

[20] J. Dickinson, A. Jahan-Latibari, L. Jensen: J. Mater. Sci., 20 (1985) p.229

[21] T. Ogawa, K. Oike, T. Miura: J. Geophys. Res. - Atmos., 90 (1985), p.6245

[22] B. Srilakshmi, A. Misra: J. Mater. Sci., 40 (2005) p.6079

[23] S. Aman, J. Tomas, A. Streletskii: Chinese Phys. Lett., 28 (2011), p.87802.

[24] S. Aman, J. Tomas: Chem. Eng. Technol., 27 (2004), p.1258

[25] S. Aman, J. Tomas: Chem-Ing-Tech, 76 (2004), p.81

[26] P Koktavy: Meas. Sci. Technol., 20 (2009), p.15704

[27] S. Aman, A. Aman, W. Morgner: Compos. Sci. Technol., 84 (2013), p.58