Embedded Seal Cavity Fabricated in HTCC MEMS Technology

Chen Li; Qiu Lin Tan; Ji Jun Xiong; Wen Dong Zhang; Zhong Ren; Ming Liang Yang; Tao Luo

doi:10.4028/www.scientific.net/KEM.609-610.461

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 609-610Embedded Seal Cavity Fabricated in HTCC MEMS...

Embedded Seal Cavity Fabricated in HTCC MEMS Technology

Abstract:

This article presents a design and fabrication method of a embedded cavity using alumina casting-belt. This method is based on HTCC (high-temperature co-fired ceramic) MEMS technology with using fugitive materials. The test structures are fabricated using two different fugitive materialsPolyimide film and ESL4900 film and two different lamination pressures (15MPa and 21MPa). The final stack was sintered by selecting different temperature process parameters in the high-temperature sintering process. Complete the analysis of the sample cavity structure using a SEM (scanning electron microscope). The manufacturing method is available for structural integrity and good air tightness of ceramics sealed cavity and it will be applied to the fabrication of flow sensors, capacitance pressure sensors etc.

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Periodical:

Key Engineering Materials (Volumes 609-610)

Pages:

461-467

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.609-610.461

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Online since:

April 2014

Authors:

Chen Li, Qiu Lin Tan, Ji Jun Xiong*, Wen Dong Zhang, Zhong Ren, Ming Liang Yang, Tao Luo

Keywords:

Embedded Sealed Cavity, Fugitive Materials, HTCC, Temperature Parameters

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* - Corresponding Author

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