Glass Frit as a Hermetic Joining Material for Bonding among Three Wafers with Metallic Film Feed-Through

Cong Zhao; Jian Wang; Shi Ming Zhang; Jiang Bo Zou

doi:10.4028/www.scientific.net/KEM.609-610.489

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 609-610Glass Frit as a Hermetic Joining Material for...

Glass Frit as a Hermetic Joining Material for Bonding among Three Wafers with Metallic Film Feed-Through

Abstract:

This paper reports a sealing process for reliable hermetic wafer-scale packaging among three wafers forming sandwich structure by glass frit. The process could be applied to Si, quartz crystal, SiC wafers and so on. The device wafer is bonded to the capping wafer in the first step and to another capping wafer forming vacuum-cavities in the second step. Experimental results indicate that the average bonding strength of packaging structure reached as high as 0.85kg/mm2 fulfilling MIL-STD-833E standard. The average leakage rate fits the standard of GJB-548A.This paper also realizes glass frit hermetic bonding in the case of Au/Cr and Pt/Ti film feed-through deposited on the device wafer.Experimental results indicate that Pt/Ti film feed-through hold up to bonding temperature cycling and avoid dissolution and adherence reduction compared with Au/Cr film feed-through

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Periodical:

Key Engineering Materials (Volumes 609-610)

Pages:

489-494

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.609-610.489

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Online since:

April 2014

Authors:

Cong Zhao*, Jian Wang, Shi Ming Zhang, Jiang Bo Zou

Keywords:

Bonding among Three Wafers, Glass Frit Bonding, Hermetic Packaging, Metallic Film Feed-Through

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