Experimental Investigation and Numerical Simulation of Pure Copper Foil Springback in Micro-Bending Process

Xiao Juan Lin; Guang Chun Wang; Hua Jiang; Jin Li

doi:10.4028/www.scientific.net/KEM.609-610.531

Paper Titles

Investigation on Dissolving Process of Secondary Phases and Austenitic Grain Growth in a Microalloyed Steel
p.509

Evolution in Dislocation Configuration of Deformed Fe-40Ni-Ti Alloy during Isothermal Relaxation
p.515

Viscous Dissipation of Polymer Melt in Micro Channels and Macro Channels
p.521

Influence of Sonomechanical Treatment on the Structure of Cellulose Micro/Nano Fibrils
p.526

Experimental Investigation and Numerical Simulation of Pure Copper Foil Springback in Micro-Bending Process
p.531

Smoothness Control of Wet Etched Si{100} Surfaces in TMAH+Triton
p.536

Fabrication, Characterization and Photocatalytic Activity of TiO₂/Cellulose Composite Aerogel
p.542

The Fabrication of High Resistance-Temperature-Coefficient Vanadium Oxide Film by Magnetron Sputtering Method
p.547

Research on the Characterization of Ultra-Smooth K9 Glass Surface Polished by Nanoparticle Colloid Jet Machining
p.552

HomeKey Engineering MaterialsKey Engineering Materials Vols. 609-610Experimental Investigation and Numerical...

Experimental Investigation and Numerical Simulation of Pure Copper Foil Springback in Micro-Bending Process

Abstract:

Springback is an important factor influencing forming precision in bending process, which becomes more complex for micro metal foil due to the size effect existing. Bending springback is studied through the micro bending experiments designed with different grain sizes and foil thicknesses using T2 purple copper in this paper. The accurate stress-strain relationships are obtained based on the copper foil tensile experiments; the bending process of micro-component is simulated based on both dynamic explicit and static implicit codes. Comparison of simulation results with experimental results shows that: thickness can serve as an important parameter effecting on the springback; the trend of springback amount rising with a thickness diminishing enhances in small size; sheets with same thickness exhibit phenomenon of springback angle reducing with an increasing grain size. Bending springback of micro metal foil indicates obvious size effect on foil thickness and grain size.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 609-610)

Pages:

531-535

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.609-610.531

Citation:

Cite this paper

Online since:

April 2014

Authors:

Xiao Juan Lin, Guang Chun Wang*, Hua Jiang, Jin Li

Keywords:

Micro-Bending, Numerical Simulation, Size Effect, Springback, T2 Pure Copper Foil

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] U Engel, R Eckstein, Microforming-from basic research to its realization,J. Journal of Materials Processing Technology. 9(2002)35-44.

DOI: 10.1016/s0924-0136(02)00415-6

Google Scholar

[2] Suzuki K, Matsuki Y , Tensile and microbend tests of pure aluminum foils with different thicknesses ,J. Materials Science and Engineering . 513-514 (2009): 77-82.

DOI: 10.1016/j.msea.2009.01.045

Google Scholar

[3] L.V. Raulea, AMGoijaerts, Size effects in the processing of thin metal sheets,J. Journal of Materials Processing Tehnology,. 115 (2001): 44-48.

DOI: 10.1016/s0924-0136(01)00770-1

Google Scholar

[4] Jenn-Terng Gau, Principe C, Springback behavior of brass in micro sheet forming,J. Journal of Materials Processing Technology, 191(2007): 7-10.

DOI: 10.1016/j.jmatprotec.2007.03.035

Google Scholar

[5] WANG Chunju, GUO Bin, U bending process of T2 copper foil,J. Optics and Precision Engineering. 18(2010)2610-2615.

Google Scholar