Interface Formation of Unidirectional SiCf/SiC Composites by Electrophoretic Deposition Method

Katsumi Yoshida; Hiroyuki Akimoto; Akihiro Yamauchi; Toyohiko Yano; Masaki Kotani; Toshio Ogasawara

doi:10.4028/www.scientific.net/KEM.617.213

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 617Interface Formation of Unidirectional SiCf/SiC...

Interface Formation of Unidirectional SiC_f/SiC Composites by Electrophoretic Deposition Method

Abstract:

C-and BN-interphases on SiC fibers for unidirectional SiC_f/SiC composites were formed by EPD process, and their microstructure and mechanical properties were investigated. Whereas the C-SiC_f/SiC composites showed a pseudo-ductile fracture behavior with large amount of fiber pullout, the BN-SiC_f/SiC composites fractured in a brittle manner without fiber pullout in spite of sufficient thickness of BN interphase. It is inferred from the results of EDS that sintering additives would react with h-BN-interphase, and the interphase did not act effectively for toughening the SiC_f/SiC composites.

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Periodical:

Key Engineering Materials (Volume 617)

Pages:

213-216

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.617.213

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Online since:

June 2014

Authors:

Katsumi Yoshida*, Hiroyuki Akimoto, Akihiro Yamauchi, Toyohiko Yano, Masaki Kotani, Toshio Ogasawara

Keywords:

Electrophoretic Deposition (EPD), Interphases, Mechanical Property, SiC_f/SiC Composite

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References

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