Experimental Investigation of Interfacial Compounds Evolution in Ultra-Thin Roll Bonded Cu/Al/Cu Strip

Abstract:

Ultra-thin Cu/Al clad strip with 0.12 mm thickness was successfully fabricated by accumulative roll bonding and the interfacial structure of Cu/Al clad strip has been characterized by means of optical microscope (OM), energy dispersive spectroscopy (EDS), scanning electron microscopy (SEM) and also X-ray diffraction (XRD). The intermetallic phases and their formation sequence at the interface was experimentally verified. And the growth kinetics of each phase was also modeled considering the diffusion controlled reaction mechanism. The effect of interfacial compounds on tensile fracture of ultra-thin Cu/Al clad strip was also studied. The obtained results indicate that, intermetallic compounds formed in the interface region of ultra-thin Cu/Al clad strip within the experimental condition are confirmed to be Al₂Cu, Al4Cu9 and AlCu in sequence. The calculated activation energies for the growth of Al₄Cu₉, AlCu and Al₂Cu are 101.45、114.30 and 95.15 kJ/mol, respectively. The major cracks propagate through the AlCu intermetallic layer and the Al₂Cu / AlCu interface.

• Periodical: Key Engineering Materials (Volumes 622-623)
• Pages: 492-500
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.622-623.492
• Online since: September 2014
• Authors: Hong Wu Song*, Yang Yu, Yong Xu, Yan Chen, Shi Hong Zhang
• Keywords: Accumulative Roll Bonding, Annealing, Diffusion, Fracture Mechanism, Intermetallic Phase, Ultra-Thin Cu/Al Clad Strip

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