An Investigation of Factors Affecting and Optimizing Material Removal Rate in Computer Controlled Ultra-Precision Polishing

Lai Ting Ho; Chi Fai Cheung; Liam Blunt; Sheng Yue Zeng

doi:10.4028/www.scientific.net/KEM.625.446

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 625An Investigation of Factors Affecting and...

An Investigation of Factors Affecting and Optimizing Material Removal Rate in Computer Controlled Ultra-Precision Polishing

Abstract:

There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.

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Periodical:

Key Engineering Materials (Volume 625)

Pages:

446-452

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.625.446

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Online since:

August 2014

Authors:

Lai Ting Ho*, Chi Fai Cheung, Liam Blunt, Sheng Yue Zeng

Keywords:

ANOVA, Computer Controlled Polishing, Mechanical Polishing, Process Optimization, Taguchi Method, Ultra-Precision Machining

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References

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