Edge Effect and Compensation Method Research of the Template Electrochemical Etching

Hong Yu Wei; Zhong Ning Guo; Guan Wang

doi:10.4028/www.scientific.net/KEM.625.559

Paper Titles

Technology Evolution of Lower Extremity Exoskeleton from the Patent Perspective
p.536

A Proposal of Process Strategy for Micro-Cutting Edge Fabrication: Effects of Shape Formation after Laser Hardening
p.545

Basic Study on Etching Selectivity of Plasma Chemical Vaporization Machining by Introducing Crystallographic Damage into Work Surface
p.550

Characteristics of Electrical Discharge Machining in a Working Fluid Mixed with Micro-Bubbles
p.554

Edge Effect and Compensation Method Research of the Template Electrochemical Etching
p.559

FEM Simulation on the Effect of Cutting Parameters in the Driven Rotary Cutting
p.564

Figuring and Finishing of Reaction-Sintered SiC by Anodic Oxidation Assisted Process
p.570

Improvement of Accuracy in Micro-EDM of Tungsten Carbide Using Deionized Water
p.576

Improvement of Drill Life for Nickel Super Alloy by Ultrasonic Vibration Machining with Minimum Quantity Lubrication
p.581

HomeKey Engineering MaterialsKey Engineering Materials Vol. 625Edge Effect and Compensation Method Research of...

Edge Effect and Compensation Method Research of the Template Electrochemical Etching

Abstract:

Uniformity is an important index of the template electrochemical etching. Due to the uneven current distribution between the two electrodes, the etching depth of the workpiece center and edge are significantly different,and the deviation of which is up to 15% or more. In this study, the causes of edge effect is analyzed. A compensation method is proposed and proved by experiments.The results show that: this method is simple, and the uniformity can be reduced to about 3%. It is suitable for the processing of high uniformity requirements in microstructure machining.

You might also be interested in these eBooks

Precision Engineering and Nanotechnology V

View Preview

Info:

Periodical:

Key Engineering Materials (Volume 625)

Pages:

559-563

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.625.559

Citation:

Cite this paper

Online since:

August 2014

Authors:

Hong Yu Wei*, Zhong Ning Guo, Guan Wang

Keywords:

Edge Effect, Electrochemical Etching, Uniformity

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] P. Kern, J. Veh, J. Michler, New developments in through-mask electrochemical micromachining of titanium,J. Journal of Micromechanics and Microengineering. 17. 6(2007)1168.

DOI: 10.1088/0960-1317/17/6/010

Google Scholar

[2] J. Kozak, K. P. Rajurkar, Y. Makkar, Selected problems of micro-electrochemical machining, J. Mater. Process. Technol. 149 (2004) 426–431.

DOI: 10.1016/j.jmatprotec.2004.02.031

Google Scholar

[3] K. P. Rajurkar, G. Levy, A. Malshe, et al, Micro and nano machining by electro-physical and chemical processes,J. CIRP Annals-Manufacturing Technology. 55. 2(2006) 643-666.

DOI: 10.1016/j.cirp.2006.10.002

Google Scholar

[4] M. Datta, D. Landolt, Fundamental aspects and applications of electrochemical microfabrication, J. Electrochimica acta. 45. 15 (2000) 2535-2558.

DOI: 10.1016/s0013-4686(00)00350-9

Google Scholar

[5] M. Datta, D. Landolt, Fundamental aspects and applications of electrochemical microfabrication , J. Electrochim Acta. 45 (2000) 2535–2558.

DOI: 10.1016/s0013-4686(00)00350-9

Google Scholar

[6] J. Kozak, Computer simulation system for electrochemical shaping,J. Mater. Process. Technol. 109 (2001) 354–359.

Google Scholar

[7] P. Raffelstetter, B. Mollay, On the modeling of shape evolution in through-mask electrochemical micromachining of complex patterned substrates,J. Electrochimica Acta. 55. 6(2010) 2149-2157.

DOI: 10.1016/j.electacta.2009.11.049

Google Scholar

[8] D. Zhu, et al, Electrochemical Micromachiningof Microstructures of Micro hole and Dimple Array,J. Annals of the CIRP. 58 . 1 (2009)177–180.

DOI: 10.1016/j.cirp.2009.03.004

Google Scholar