The Study of Nickel on Copper Nitride Thin Films Deposited by Magnetron Sputtering

Abstract:

Ni-doped copper nitride films have been prepared by co-sputtering of Ni and Cu targets. The addition of Ni to Cu₃N films reduced the intensity of the (111) diffraction peak, and lead a little angular shifts of the peaks. The films showed a large difference in reflectance in the infrared and visible before and after thermal decomposition, which is applicable to optical recording media. The films change from a semiconductor to a conductor with the increased ratio of Ni in Cu₃N films.

• Periodical: Key Engineering Materials (Volume 636)
• Pages: 29-32
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.636.29
• Online since: December 2014
• Authors: Xing Ao Li*, Rong Yang, Wen Jie Liu, Jia Han, Jian Bo Yang, Jian Ping Yang, Tao Yang, Min Fen Gu
• Keywords: Copper Nitride Thin Film, Crystal Structure, Ni-Doped, Reactive Magnetron Sputtering, Surface Morphology

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