Study on the Etching Technique of Non-Photosensitive Polyimide

Rui Lei; Wei Guo Liu; Chang Long Cai; Shun Zhou; Jing Nie; Xuan Yang Wang

doi:10.4028/www.scientific.net/KEM.645-646.163

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 645-646Study on the Etching Technique of...

Study on the Etching Technique of Non-Photosensitive Polyimide

Abstract:

Polyimide is often used as a sacrificial layer material to make floating structure. Polyimide is also divided into photosensitive and non-photosensitive type; photosensitive polyimide currently has more negative photoresist and poor performance in many ways. Compared with photosensitive polyimide, the non-photosensitive type has low stress, stable performance and other advantages, so non-photosensitive polyimide has been chosen as a sacrificial layer material. To achieve the graphical function and release sacrificial layer, A deeply research was made in this dissertation makes on wet etching and dry etching. By controlling the wet etching process of prebake condition, exposure and developing time, and oxygen dry etching process of etching power, bias voltage and other key process parameters, a good sacrificial layer graph and etching effect have been got. Finally, it can be concluded that when the prebake conditions for 105°C, 8min and times of exposure and developing were 11s and 29s, the non-photosensitive polyimide wet etching effect is the best; when the etching power is 1000w, an oxygen flux rate is 50sccm, the reaction pressure is 30mTorr, the bias voltage is 140v, oxygen dry etching has a good effect.

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Periodical:

Key Engineering Materials (Volumes 645-646)

Pages:

163-168

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.645-646.163

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Online since:

May 2015

Authors:

Rui Lei*, Wei Guo Liu, Chang Long Cai, Shun Zhou, Jing Nie, Xuan Yang Wang

Keywords:

Dry Etching, Non-Photosensitive Polyimide, Wet Etching

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* - Corresponding Author

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