Interfacial Fracture Strength of Micro-Scale Si/Cu Components with Different Free-Edge Shape

Yoshimasa Takahashi; Hikaru Kondo; Kazuya Aihara; Masanori Takuma; Kenichi Saitoh; Shigeo Arai; Shunsuke Muto; Yuta Yamamoto; Kimitaka Higuchi; Nobuo Tanaka

doi:10.4028/www.scientific.net/KEM.665.169

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Interfacial Fracture Strength of Micro-Scale Si/Cu Components with Different Free-Edge Shape
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 665Interfacial Fracture Strength of Micro-Scale Si/Cu...

Interfacial Fracture Strength of Micro-Scale Si/Cu Components with Different Free-Edge Shape

Abstract:

The strength against interfacial fracture initiation from a free-edge of Si/Cu micro-components was evaluated. The micro-scale cantilever specimens containing dissimilar interfaces were fabricated with a focused-ion-beam (FIB) technique, and they were loaded with a quantitative nanoindenter holder operated in a transmission electron microscope (TEM). The specimens were successfully fractured along the Si/Cu interface, and the critical loads at fracture were measured. The critical stress distribution near the free-edge was evaluated with the finite element method (FEM). The near-edge stress distributions of 90°/90°-shaped specimens were scattered while those of 135°/135°-shaped specimens were in good agreement despite the difference in specimen dimensions. Such a difference was discussed in terms of the relation between the magnitude of stress singularity and the microstructures of material.