Electron Microscopic Investigation on Nanostructure Behaviors of Thermal Oxidation Copper

Siti Rahmah Esa; Ghazali Omar; Rosiyah Yahya; Noreffendy Tamaldin; Aziz Hassan; Bazura Abdul Rahim; Wan Azli Wan Ismail

doi:10.4028/www.scientific.net/KEM.694.116

Paper Titles

Sintering of Beta-Tricalcium Phosphate Scaffold Using Polyurethane Template
p.94

Morphology Studies of Electrospun Lithium Iron Phosphate (LiFePO₄)/Cellulose Acetate (CA) Fibers
p.101

Synthesis and Characterization of Rice Husk Ash Derived - Silica Aerogel Beads Prepared by Ambient Pressure Drying
p.106

The Effects of Thermal Ageing on Properties and Microstructure of Al-6063 Alloy
p.111

Electron Microscopic Investigation on Nanostructure Behaviors of Thermal Oxidation Copper
p.116

A Study on (K, Na) NbO₃ Thin Films with Optimized Layer: Effect on Physical and Electrical Properties
p.120

Ba- and La- Strontium Cobalt Ferrite Carbonate Composite as Cathode Materials for Low Temperature SOFC
p.125

Effect of Dipping Numbers on the Crystalline Phase and Microstructure of Ag-TiO₂ Coating
p.133

Influence of HCl Content and Ageing Time on TiO₂ Coating Formation in Acidic Sol-Gel Solutions
p.138

HomeKey Engineering MaterialsKey Engineering Materials Vol. 694Electron Microscopic Investigation on...

Electron Microscopic Investigation on Nanostructure Behaviors of Thermal Oxidation Copper

Abstract:

A copper alloy consists of 2.6% Fe, 0.15% P and 0.2% Zn with modified grain size of 500 and 750 nm were studied on their rate of diffusion at different oxidation temperature using electron microscopic imaging technique. Different oxidation temperature contributed to the variation of copper oxide particle size, surface porosity level, particle agglomeration and particle nucleation. High oxidation temperature resulted in large oxide particles formation as well as high surface porosity. The magnitude of the copper oxide growth depended on the oxidation temperature. The increase in the oxidation rate at high oxidation temperature was likely a result of faster transport of the reactants through the bulk copper due to a significant contribution from grain-boundary diffusion.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volume 694)

Pages:

116-119

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.694.116

Citation:

Cite this paper

Online since:

May 2016

Authors:

Siti Rahmah Esa, Ghazali Omar, Rosiyah Yahya, Noreffendy Tamaldin, Aziz Hassan, Bazura Abdul Rahim, Wan Azli Wan Ismail

Keywords:

Copper Oxide, Diffusion, Nanostructures

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] S. Magdassi, M. Grouchko, A. Kamyshny, Copper nanoparticles for printed electronics: routes towards achieving oxidation stability, Materials, 3 (2010) 4626-4638.

DOI: 10.3390/ma3094626

Google Scholar

[2] K. Mimura, J. W. Lim, M. Isshiki, Y. Zhu, Q. Jiang, Brief review of oxidation kinetics of copper at 350 C to 1050 C, Metall. Mater. Trans. A, 37 (2006) 1231-1237.

DOI: 10.1007/s11661-006-1074-y

Google Scholar

[3] G. Ren, D. Hu, E.W. Cheng, , M.A. Vargas-Reus, P. Reip, R.P. Allaker, Characterisation of copper oxide nanoparticles for antimicrobial applications, Int. J. Antimicrob. Agents, 33 (2009) 587-590.

DOI: 10.1016/j.ijantimicag.2008.12.004

Google Scholar

[4] K.C. Chen, W.W. Wu, C.N. Liao, L.J. Chen, K.N. Tu, Observation of atomic diffusion at twin-modified grain boundaries in copper, Science, 321 (2008) 1066-1069.

DOI: 10.1126/science.1160777

Google Scholar

[5] Z. Han, L. Lu, H.W. Zhang, Z.Q. Yang, F.H. Wang, K. Lu, Comparison of the oxidation behavior of nanocrystalline and coarse-grain copper, Oxid. Met., 63 (2005) 261-275.

DOI: 10.1007/s11085-005-4381-6

Google Scholar

[6] R.E. Napolitano, Measurement of ASTM grain size number, Material Science and Engineering, Iowa State University, available online on http: /mse. iastate. edu.

Google Scholar

[7] D.A. Chen, M.C. Bartelt, R.Q. Hwang, K.F. McCarty, Self-limiting growth of copper islands on TiO 2 (110)-(1× 1), Surf. Sci. 450 (2000) 78-97.

DOI: 10.1016/s0039-6028(99)01251-0

Google Scholar