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HomeKey Engineering MaterialsKey Engineering Materials Vol. 700Effect of TiO2 on the Formation of Primary and...

Effect of TiO₂ on the Formation of Primary and Interfacial Cu₆Sn₅ in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering

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Abstract:

This paper investigates the effect of 1 wt% TiO₂ on the formation of primary and interfacial Cu₆Sn₅ in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder pastes soldered on a Cu substrate using a real-time synchrotron imaging technique. It was found that TiO₂ had altered the nucleation time of the primary Cu₆Sn₅ intermetallics and increased the number of particles observed. In addition, a more planar Cu₆Sn₅ interfacial layer had formed in joints made with TiO₂ reinforced solders. This indicated that TiO₂ promotes nucleation of primary Cu₆Sn₅ intermetallics in the early stages of soldering while being a barrier for further growth of interfacial Cu₆Sn₅intermetallics. The synchrotron imaging technique provides direct evidence of the sequence of events in the soldering reaction and how these are influenced by TiO₂ reinforcement.

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Periodical:

Key Engineering Materials (Volume 700)

Pages:

161-169

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.700.161

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Online since:

July 2016

Authors:

Mohd Arif Anuar Mohd Salleh*, R.M. Said, Norainiza Saud, H. Yasuda, S.D. McDonald, K. Nogita

Keywords:

Imaging, Intermetallic, Nanocomposite, Solder Paste, Synchrotron

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© 2016 Trans Tech Publications Ltd. All Rights Reserved

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