Interfacial Morphology and Mechanical Properties of Aluminium to Copper Sheet Joints by Electromagnetic Pulse Welding

Abstract:

This study investigated joining of Al to Cu sheets by electromagnetic pulse welding, which is a solid-state welding process that uses electromagnetic forces to join materials. The interfacial morphology and mechanical properties of the Al/Cu joints were analysed and related to the welding process parameters and weld properties. The centre section of the Al/Cu joints evolved from a non-welded to a welded zone. The welded zone started with a wavy interface, consisting of thick interfacial layers with defects and evolved to a relatively flat interface without an interfacial layer. The interfacial layer thickness is determined by both the discharge energy and the stand-off distance. A higher tensile force, up to 4.9 kN, was achieved at a higher energy and a lower stand-off distance of 2 mm. The tensile force is directly related to the weld width, since a higher tensile force is achieved for a higher weld width. In addition, the presence of interfacial layers can contribute to a small extent to a higher tensile force.

• Periodical: Key Engineering Materials (Volume 710)
• Pages: 109-114
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.710.109
• Online since: September 2016
• Authors: Irene Kwee*, Koen Faes
• Keywords: Aluminium-to-Copper Welds, Electromagnetic Pulse Sheet Welds, Interfacial Morphology, Tensile Strength, Weld Interface

References

[1] M. Abbasi, A. Karimi Taheri, M.T. Salehi, Growth rate of interfacial compounds in Al/Cu bimetal produced by cold roll welding process. J Alloys Compd. 319 (2001) 233-241.

DOI: 10.1016/s0925-8388(01)00872-6

[2] J.P. Bergmann, F. Petzoldt, R. Schürer, S. Schneider, Solid-state welding of aluminium to copper-case studies. Weld World 57 (2013) 541-550.

DOI: 10.1007/s40194-013-0049-z

[3] R. Schäfer, P. Pasquale, Material hybrid joining of sheet metals by electromagnetic pulse technology. PST products GmbH, Alzenau, Germany: information on http: /www. pstproducts. com/EMPT_sheetwelding_PSTproducts. pdf.

[4] S.D. Kore, P. P Date, S.V. Kulkarni, Effect of process parameters on electromagnetic impact welding of aluminium sheets. Int J Impact Eng 34 (2007) 1327-1341.

DOI: 10.1016/j.ijimpeng.2006.08.006

[5] S. D. Kore, P. Dhanesh, S.V. Kulkarni, P.P. Date, Numerical modelling of electromagnetic welding. Int J of Appl Electrom 32 (2010) 1-19.

[6] J.K. Doley, S.D. Kore, Study of impact behavior of sheets in electromagnetic pulse welding. In: The 64th Annual Assembly of the International Institute of Welding, Chennai, India. The Indian Institute of Welding, CD-ROM Edition (2011).

[7] M. Watanabe, S. Kumai, High-speed deformation and collision behavior of pure aluminium plates in magnetic pulse welding. Mater Trans 50 (2009) 2035-(2042).

DOI: 10.2320/matertrans.l-m2009816

[8] M. Watanabe, S. Kumai, Interfacial morphology of magnetic pulse welded aluminium/aluminium and copper/copper lap joints. Mater Trans 50 (2009) 286-292.

DOI: 10.2320/matertrans.l-mra2008843

[9] A. Sterb, V. Shribman, A. Ben-Artzy, M. Aizenshtein, Interface phenomena and bonding mechanism in magnetic pulse welding. J Mater Eng Perform 23 (2014) 3449-3458.

DOI: 10.1007/s11665-014-1143-0

[10] R. Raoelison, M. Rachik, N. Buiron, D. Haye, M. Morel, B. Dos Santos, D. Jouaffre, G. Franz, Assessment of gap and charging voltage influence on mechanical behavior of joints obtained by magnetic pulse welding. In: Proceedings of the 5th International Conference on High Speed Forming, Dortmund, Germany, (2012).

DOI: 10.1016/j.jmapro.2012.04.001

[11] Y. Zhang, S. Suresh Babu, C. Prothe, M. Blakely, J. Kwasegroch, M. LaHa, G. Daehn, Application of high velocity impact welding at varied different length scales. J of Mater Process Tech 21 (2011) 944-985.

DOI: 10.1016/j.jmatprotec.2010.01.001

[12] M. Marya, S. Marya, D. Priem, On the Characteristics of Electromagnetic Welds between Aluminium and Other Metals and Alloys. In: The 57th annual Assembly of the International Institute of Welding, Osaka, Japan (2004).

DOI: 10.1007/bf03263412