Paper Titles
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The Thermal-Aging Effect on the Microstructure Evolution and Shear Strength of the Sn-Rich Au-Sn Soldering between Altic and Si Substrate in Microelectronics
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The Thermal-Aging Effect on the Microstructure Evolution and Shear Strength of the Sn-Rich Au-Sn Soldering between Altic and Si Substrate in Microelectronics

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Abstract:

The Au-Sn soldering alloys are commonly used in microsoldering process for microelectronic industry due to fluxless process and relatively low melting temperature with good eutectic microstructures. This study investigated the microstructures of Au-Sn soldering between AlTiC and Si substrates with Ti/Pt/Au under bump metallization (UBM). The microstructures of the solder samples under three conditions: before bonding, after bonding and after thermal-cycle aging, were investigated. The shear strength values of pre-aging and post-aging soldering were compared. The thermal-cycling temperatures were ranged from -40 to 125 °C for 300 cycles. The intermetallic compounds (IMCs) of the AuSn solders consist of AuSn, AuSn2, and AuSn4. After thermal-cycle aging, the bonding strength was increased due to the improved IMC bonding between solders and UBM; the shear surfaces were rougher due to the growth of AuSn and AuSn2.

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Periodical:

Key Engineering Materials (Volume 751)

Pages:

3-8

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.751.3

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Online since:

August 2017

Authors:

Panaaek Athichalinthorn, Jidsucha Darayen, Wachira Puttichaem, Ratchatee Techapiesancharoenkij, Boonrat Lohwongwatana*

Keywords:

Au-Sn Intermetallic Alloy, Conductive Bonding, Lead-Free Soldering, Micro Soldering

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© 2017 Trans Tech Publications Ltd. All Rights Reserved

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