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HomeKey Engineering MaterialsKey Engineering Materials Vol. 764The Thermal Stress Simulation of the Part Caused...

The Thermal Stress Simulation of the Part Caused by Layer Thickness and Deposition Velocity in FDM Process

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Abstract:

The paper mainly simulates the effects of layer thickness and deposition velocity on thermal stress in fused deposition modelling (FDM). Different values of these variables are considered in this process. The simulation results show the trends of thermal stress with the two variables and the simulation results provide a guidance for the practical fabrication.

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Advanced Materials and Manufacturing Technology III

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Periodical:

Key Engineering Materials (Volume 764)

Pages:

115-122

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.764.115

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Online since:

February 2018

Authors:

Yi Ren Zhou, Xiao Lin Qiu, Miao Hu, Jie Li*

Keywords:

Deposition Velocity, Fused Deposition Modelling, Layer Thickness, Thermal Stress Simulation

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© 2018 Trans Tech Publications Ltd. All Rights Reserved

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* - Corresponding Author

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