Cyclic Plastic Properties of a Lead Free Solder

Daniel Antoš; Radim Halama; Matěj Bartecký

doi:10.4028/www.scientific.net/KEM.810.46

Paper Titles

Effect of Heat Treatment at (β+γ) Two Phase Region on Fracture Toughness in TiAl Intermetallic Compound
p.21

Microstructural Change and Fracture Behavior under Different Heat Exposure Conditions on Thermal Barrier Coatings Deposited on TiAl Intermetallic Compound
p.27

Fatigue Crack Growth Thresholds under Negative Stress Ratio for Aluminium Alloys
p.34

Novel Methods for High-Cycle Fatigue Life Determination
p.40

Cyclic Plastic Properties of a Lead Free Solder
p.46

Corrosion Properties of ECAP Titanium with Bioactive Oxide Coating in Physiological Solution
p.52

Influence of Passivation on Wettability of AISI 304 Steel and its Corrosion Properties in Solution of Sodium Hypochlorite
p.58

Crystal Orientation Analysis on Stress Corrosion Cracking Facets in Austenitic Stainless Steels
p.64

Comparison of Behaviour of Different Variants of Hydrogenated TRIP Steels at Slow Strain Rate Tests
p.70

HomeKey Engineering MaterialsKey Engineering Materials Vol. 810Cyclic Plastic Properties of a Lead Free Solder

Cyclic Plastic Properties of a Lead Free Solder

Abstract:

This paper shows some cyclic plastic properties of the lead free solder alloy Sn-3.5Ag-0.75 under fully reversed cyclic torsional loading. The low-cycle fatigue behavior of the material was evaluated too. The lead free solder material reveals a strong strain rate effect. A viscoplastic model was implemented into a commercial finite element program and calibrated using data from literature to can be used for simulations of all performed tests in a future work.

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Periodical:

Key Engineering Materials (Volume 810)

Pages:

46-51

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.810.46

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Online since:

July 2019

Authors:

Daniel Antoš, Radim Halama*, Matěj Bartecký

Keywords:

Fatigue, Sn-3.5Ag-0.75Cu, Solder Paste, Viscoplasticity

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References

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