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HomeKey Engineering MaterialsKey Engineering Materials Vol. 830A Study on the Effect of Process Parameters on...

A Study on the Effect of Process Parameters on Thin NAND Flash Wafer by Multi - Beam Matrix Laser Cutting

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Abstract:

This study is designed to investigate the influence of multi-beam matrix laser cutting process on NAND Flash package quality, and find out the important process parameters of multi-beam matrix laser process are defocus amount, laser power, cutting speed and material thickness. Then use the finite element analysis software ANSYS to obtain the minimum temperature influence, stress and strain, and use Taquchi method and variance analysis (ANOVA) to find the optimal temperature combination, the optimal combination of stress and strain and its contribution degree. Finally, the reliability is tested by verification experiments, and the error is found to be within 3.638%. It is confirmed that the optimized parameter combination has high repetitiveness. It is hoped that this study can contribute to the multi-beam matrix laser cutting process.

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Materials and Technologies in Precision Machinery II

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Periodical:

Key Engineering Materials (Volume 830)

Pages:

59-67

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.830.59

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Online since:

February 2020

Authors:

Cheng Zhu Li, Ruei Han Chen, Jun Yi Lin, Liang An Zheng, Chao Ming Hsu*

Keywords:

ANSYS, Assembly Process, Reliability, Taguchi Experimental Method, Thermal Effect

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© 2020 Trans Tech Publications Ltd. All Rights Reserved

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