Effect of Different Abrasives on Chemical Mechanical Polishing for Magnesia Alumina Spinel

Abstract:

In this paper, a series of chemical mechanical polishing (CMP) experiments for magnesia alumina (Mg-Al) spinel were carried out with different abrasives, and the materials removal rate (MRR) and surface quality was evaluated to explore their different effects. The scanning electron microscope (SEM) and laser particle size analyzer were also employed to test the micro-shape and size distribution of abrasives. Then, the mechanism of different effects with different abrasives was analyzed in CMP for Mg-Al spinel. Those experimental results suggest that different subjecting pressure ratios of abrasives to polishing pad with different abrasive are the key factors leading to difference polishing performances in CMP.

• Periodical: Key Engineering Materials (Volume 866)
• Pages: 115-124
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.866.115
• Online since: October 2020
• Authors: Zhan Kui Wang*, Ming Hua Pang, Jian Xiu Su, Jian Guo Yao
• Keywords: Abrasive, Chemical Mechanical Polishing, Magnesium Aluminate Spinel, Material Removal Rate, Surface Quality

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